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  • SN74AUC1G17 Single Schmitt-Trigger Buffer

    • SCES376O SEPTEMBER   2001  – June 2017 SN74AUC1G17

      UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  • CONTENTS
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  • SN74AUC1G17 Single Schmitt-Trigger Buffer
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics: CL = 15 pF
    7. 6.7 Switching Characteristics: CL = 30 pF
    8. 6.8 Operating Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Community Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
  11. IMPORTANT NOTICE

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DCK|5
  • DRL|5
  • YZP|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information
  • sces376o_oa
  • sces376o_pm
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DATA SHEET

SN74AUC1G17 Single Schmitt-Trigger Buffer

1 Features

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial Power Down Mode and Back Drive Protection
  • Sub 1-V Operable
  • Maximum tpd of 2.4 ns at 1.8 V
  • Low Power Consumption, 10-µA Maximum ICC
  • ±8-mA Output Drive at 1.8 V

2 Applications

  • AV Receiver
  • Audio Dock: Portable
  • Blu-Ray Player and Home Theater
  • Embedded PC
  • MP3 Player/Recorder (Portable Audio)
  • Personal Digital Assistant (PDA)
  • Power: Telecom/Server AC/DC Supply: Single Controller: Analog and Digital
  • Solid State Drive (SSD): Client and Enterprise
  • TV: LCD/Digital and High-Definition (HDTV)
  • Tablet: Enterprise
  • Video Analytics: Server
  • Wireless Headset, Keyboard, and Mouse

3 Description

This single Schmitt-trigger buffer is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For more information about AUC Little Logic devices, see Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, SCEA027.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SN74AUC1G17DBV SOT-23 (5) 2.90 mm × 1.60 mm
SN74AUC1G17DCK SC70 (5) 2.00 mm × 1.25 mm
SN74AUC1G17DRL SOT-5X3 (5) 1.60 mm × 1.20 mm
SN74AUC1G17YZP DSBGA (5) 1.75 mm × 1.25 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Logic Diagram (Positive Logic)

SN74AUC1G17 ld_ces376.gif

4 Revision History

Changes from N Revision (April 2007) to O Revision

  • Deleted DRY package throughout data sheetGo
  • Added Applications, Device Information table, Pin Configuration and Functions, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information table, see Mechanical, Packaging, and Orderable Information at the end of the data sheet Go

5 Pin Configuration and Functions

DBV Package
5-Pin SOT-23
Top View
SN74AUC1G17 po2_ces376-1.gif
DCK Package
5-Pin SC70
Top View
SN74AUC1G17 po2_ces376-2.gif
See mechanical drawings for dimensions.
NC – No internal connection
DNU – Do not use
DRL Package
5-Pin SOT-5X3
Top View
SN74AUC1G17 po2_ces376-3.gif
YZP Package
5-Pin DSBGA
Bottom View
SN74AUC1G17 SN74AUC1G17_yzp_po.gif

Pin Functions

PIN I/O DESCRIPTION
NAME DBV, DCK, DRL YZP
A 2 B1 I A logic input
DNU — A1 — Do not use
GND 3 C1 — Ground
NC 1 — — No internal connection
VCC 5 A2 — Positive supply
Y 4 C2 O Y buffered output

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 3.6 V
VI Input voltage(2) –0.5 3.6 V
VO Voltage range applied to any output in the high impedance or power-off state(2) –0.5 3.6 V
VO Output voltage(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±20 mA
Continuous current through VCC or GND ±100 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) 1000
Machine Model (A115-A) 200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

See(1)
MIN MAX UNIT
VCC Supply voltage 0.8 2.7 V
VI Input voltage 0 3.6 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 0.8 V –0.7 mA
VCC = 1.1 V –3
VCC = 1.4 V –5
VCC = 1.65 V –8
VCC = 2.3 V –9
IOL Low-level output current VCC = 0.8 V 0.7 mA
VCC = 1.1 V 3
VCC = 1.4 V 5
VCC = 1.65 V 8
VCC = 2.3 V 9
TA Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

THERMAL METRIC(1) SN74AUC1G17 UNIT
DBV (SOT-23) DCK (SC70) DRL (SOT-5X3) YZP (DSBGA)
5 PINS 5 PINS 5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 206 252 142 132 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
VT+ Positive-going input threshold voltage 0.8 V 0.5 V
1.1 V 0.51 0.86
1.4 V 0.65 1
1.65 V 0.79 1.16
2.3 V 1.11 1.56
VT– Negative-going input threshold voltage 0.8 V 0.3 V
1.1 V 0.22 0.53
1.4 V 0.3 0.58
1.65 V 0.39 0.62
2.3 V 0.58 0.87
ΔVT Hysteresis ( VT+ – VT–) 0.8 V 0.21 V
1.1 V 0.25 0.38
1.4 V 0.31 0.5
1.65 V 0.37 0.62
2.3 V 0.48 0.77
VOH IOH = –100 μA 0.8 V to 2.7 V VCC – 0.1 V
IOH = –0.7 mA 0.8 V 0.55
IOH = –3 mA 1.1 V 0.8
IOH = –5 mA 1.4 V 1
IOH = –8 mA 1.65 V 1.2
IOH = –9 mA 2.3 V 1.8
VOL IOL = 100 µA 0.8 V to 2.7 V 0.2 V
IOL = 0.7 mA 0.8 V 0.25
IOL = 3 mA 1.1 V 0.3
IOL = 5 mA 1.4 V 0.4
IOL = 8 mA 1.65 V 0.45
IOL = 9 mA 2.3 V 0.6
II A input VI = VCC or GND 0 to 2.7 V ±5 µA
Ioff VI or VO = 2.7 V 0 ±10 µA
ICC VI = VCC or GND, IO = 0 0.8 V to 2.7 V 10 µA
Ci VI = VCC or GND 2.5 V 3 pF
(1) All typical values are at TA = 25°C.

6.6 Switching Characteristics: CL = 15 pF

over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 0.8 V VCC = 1.2 V
± 0.1 V		 VCC = 1.5 V
± 0.1 V		 VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 UNIT
TYP MIN MAX MIN MAX MIN TYP MAX MIN MAX
tpd A Y 5.7 0.8 3.9 0.7 2.1 0.6 1.1 1.9 0.5 1.5 ns

6.7 Switching Characteristics: CL = 30 pF

over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 1.8 V
± 0.15 V		 VCC = 2.5 V
± 0.2 V		 UNIT
MIN TYP MAX MIN MAX
tpd A Y 0.8 1.4 2.4 0.7 2.5 ns

6.8 Operating Characteristics

TA = 25°C
PARAMETER TEST
CONDITIONS		 VCC = 0.8 V VCC = 1.2 V VCC = 1.5 V VCC = 1.8 V VCC = 2.5 V UNIT
TYP TYP TYP TYP TYP
Cpd Power dissipation
capacitance		 f = 10 MHz 15 15 16 16 20 pF

7 Parameter Measurement Information

SN74AUC1G17 pmi_ces376.gif Figure 1. Load Circuit and Voltage Waveforms

 
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