SCES604J SEPTEMBER   2004  – December 2016 SN74AUP1G00

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 5 pF
    7. 6.7  Switching Characteristics, CL = 10 pF
    8. 6.8  Switching Characteristics, CL = 15 pF
    9. 6.9  Switching Characteristics, CL = 30 pF
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delays, Setup and Hold Times, and Pulse Width
    2. 7.2 Enable and Disable Times
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • YFP|6
  • DRL|5
  • DRY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from I Revision (June 2014) to J Revision

  • Changed X2SON package pin count from: "(4)" to: "(5)"Go
  • Added DSF (SON) (6), YFP (DSBGA) (6), and YZP (DSBGA) (5) packages to Device InformationGo
  • Changed pinout images with new diagramsGo
  • Changed Pin Functions table to Pin Functions — DBV, DCK, DRL, DPW, DRY, and DSF and Pin Functions — YZP and YFP tablesGo
  • Added missing pinout information to Pin Functions table Go
  • Added Junction temperature, TJ Go
  • Changed Handling Ratings table to a ESD Ratings tableGo
  • Changed unit from: "A" to:"µA" for IOL at VCC = 0.8 V Go
  • Added Receiving Notification of Documentation Updates section and Community Resources sectionGo

Changes from H Revision (April 2012) to I Revision

  • Updated document to new TI data sheet format.Go
  • Removed Ordering Information table.Go
  • Updated Ioff in Features. Go
  • Added Applications.Go
  • Added Device Information table. Go
  • Added DPW PackageGo
  • Added Handling Ratings table.Go
  • Added Thermal Information table.Go
  • Added Typical Characteristics.Go

Changes from G Revision (March 2010) to H Revision

  • Corrected the MIN Value for 1.2 V per available characterization data.Go