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SN74AUP1G00

ACTIVE

Single 1-input, 0.8-V to 3.6-V low power NAND gate

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Data sheet

SN74AUP1G00

ACTIVE
Data sheet Order now

Product details

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 Inputs per channel 1 IOL (max) (mA) 4 IOH (max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 100 Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 Inputs per channel 1 IOL (max) (mA) 4 IOH (max) (mA) -4 Input type Standard CMOS Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 100 Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 6 1.4000000000000001 mm² 1 x 1.4000000000000001 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 5 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DPW) 5 0.64 mm² 0.8 x 0.8 X2SON (DSF) 6 1 mm² 1 x 1
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Ultra Small 0.64 mm2 Package (DPW) with 0.5-mm Pitch
  • Low Static-Power Consumption (ICC = 0.9 µA Max)
  • Low Dynamic-Power Consumption (Cpd = 4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise Overshoot and Undershoot <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.8 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Ultra Small 0.64 mm2 Package (DPW) with 0.5-mm Pitch
  • Low Static-Power Consumption (ICC = 0.9 µA Max)
  • Low Dynamic-Power Consumption (Cpd = 4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise Overshoot and Undershoot <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input (Vhys = 250 mV Typical at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4.8 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

This single 2-input positive-NAND gate performs the Boolean function Y = A × B or Y = A + B in positive logic.

This single 2-input positive-NAND gate performs the Boolean function Y = A × B or Y = A + B in positive logic.
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Technical documentation

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Type Title Date
* Data sheet SN74AUP1G00 Low-Power Single 2-Input Positive-NAND Gate datasheet (Rev. J) PDF | HTML 07 Dec 2016
Application brief Understanding Schmitt Triggers (Rev. A) PDF | HTML 22 May 2019
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Application note Designing and Manufacturing with TI's X2SON Packages 23 Aug 2017
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
Not available on TI.com
Evaluation board

HALL-TRIGGER-EVM — Evaluation module for contactless, Hall-effect variable-speed trigger with external field protection

This evaluation module (EVM) uses Hall-effect sensors to implement a trigger that outputs a varying voltage based on how far the trigger is pressed. The EVM uses a contactless approach that reduces wear and tear compared to traditional mechanical-based triggers, thereby improving product lifetime. (...)
User guide: PDF | HTML
Not available on TI.com
Simulation model

SN74AUP1G00 Behavioral SPICE Model

SCEM695.ZIP (7 KB) - PSpice Model
Download
Simulation model

SN74AUP1G00 IBIS Model (Rev. A)

SCEM461A.ZIP (64 KB) - IBIS Model
Download
Reference designs

TIDA-00570 — High Speed DLP Sub-system for Industrial 3D Printing and Digital Lithography Reference Design

The High Speed DLP® Sub-system Reference Design provides system-level DLP development board designs for industrial Digital Lithography and 3D Printing applications that require high resolution, superior speed and production reliability. The system design offers maximum throughput by integrating (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-060032 — Contactless, Hall-effect variable-speed trigger reference design with external field protection

This reference design uses Hall-effect sensors to implement a trigger that outputs varying voltage based on how far the trigger is pressed. These types of triggers are useful in cordless power tools or any other end equipment that uses trigger displacement information.

The design uses a contactless (...)

Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
DSBGA (YFP) 6 Ultra Librarian
SOT-23 (DBV) 5 Ultra Librarian
SOT-5X3 (DRL) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian
USON (DRY) 6 Ultra Librarian
X2SON (DPW) 5 Ultra Librarian
X2SON (DSF) 6 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

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