SCLS299F January   1996  – June 2022 SN54HC175 , SN74HC175

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions (1)
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Timing Requirements
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • PW|16
  • NS|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

These positive-edge-triggered D-type flip-flops have a direct clear (CLR) input. The ’HC175 devices feature complementary outputs from each flip-flop.

Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
SN54HC175J CDIP (16) 24.38 mm × 6.92 mm
SN74HC175D SOIC (16) 9.90 mm × 3.90 mm
SN74HC175DBR SSOP (16) 6.20 mm × 5.30 mm
SN74HC175N PDIP (16) 19.31 mm × 6.35 mm
SN74HC175NSR SO (16) 6.20 mm × 5.30 mm
SN74HC175PW TSSOP (16) 5.00 mm × 4.40 mm
SNJ54HC175FK LCCC (20) 8.89 mm × 8.45 mm
SNJ54HC175W CFP (16) 10.16 mm × 6.73 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
GUID-20210923-SS0I-07NJ-MTKX-CQMDXH1QF2F0-low.png

Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.

Functional Block Diagram