4 Revision History
Changes from Revision C (June 2021) to Revision D (December 2021)
- Added WBQB package information to the Device Information
table.Go
- Added WBQB Package pinout diagram and information to Pin
Configuration and Functions.Go
- Added WBQB package to Thermal Information tableGo
- Added wettable flanks to Feature Description
Go
Changes from Revision B (March 2021) to Revision C (June 2021)
- Changed DYY package from Product Preview to Production
DataGo
Changes from Revision A (February 2021) to Revision B (March 2021)
- Added DYY Package pinout diagram and information to Pin
Configuration and Functions.Go
- Added DYY Package to Thermal Information tableGo
Changes from Revision * (August 2020) to Revision A (February 2021)
- Added BQB package information to the Device Information
table.Go
- Added BQB package information to Pin Configuration and
Functions
Go
- Added BQB package information to the Thermal Information tableGo