SCLS821C July   2020  – February 2022 SN74HCS244-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     4
    2.     5
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     8
    2.     9
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
      4. 8.3.4 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Functions
PIN I/O(1) DESCRIPTION
Name TSSOP NO.
1OE 1 I Bank 1, output enable, active low
1A1 2 I Bank 1, channel 1 input
2Y4 3 O Bank 2, channel 4 output
1A2 4 I Bank 1, channel 2 input
2Y3 5 O Bank 2, channel 3 output
1A3 6 I Bank 1, channel 3 input
2Y2 7 O Bank 2, channel 2 output
1A4 8 I Bank 1, channel 4 input
2Y1 9 O Bank 2, channel 1 output
GND 10 — Ground
2A1 11 I Bank 2, channel 1 input
1Y4 12 O Bank 1, channel 4 output
2A2 13 I Bank 2, channel 2 input
1Y3 14 O Bank 1, channel 3 output
2A3 15 I Bank 2, channel 3 input
1Y2 16 O Bank 1, channel 2 output
2A4 17 I Bank 2, channel 4 input
1Y1 18 O Bank 1, channel 1 output
2OE 19 I Bank 2, output enable, active low
VCC 20 — Positive supply
Thermal Pad(2) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output.
(2) WRKS package only.