SCLS782D November   2019  – December 2021 SN74HCS74

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (January 2021) to Revision D (December 2021)

  • Added DYY package information to Device InformationGo
  • Added DYY package information to Pin Configuration and Functions Go
  •  Added DYY package to Thermal Information tableGo

Changes from Revision B (November 2020) to Revision C (January 2021)

  • Changed BQA package status from Preview to ActiveGo
  • Changed data sheet status from Mixed Status to Production DataGo

Changes from Revision A (May 2020) to Revision B (November 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the document.Go
  • Added BQA package information to Device InformationGo
  • Added BQA pinout diagram and package information to Pin Configuration and Functions Go
  • Added BQA package to Thermal Information tableGo

Changes from Revision * (November 2019) to Revision A (May 2020)

  • Added D package information to Device InformationGo
  • Added D package information to Pin Configuration and Functions Go
  • Added D package column to Thermal Information tableGo