SCLS042F July   1986  – October 2022 SN54HCT04 , SN74HCT04

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Revision History
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions (1)
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics
    6. 5.6 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC D (SOIC) N (PDIP) NS (SO) PW (TSSOP) UNIT
14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance(1) 138.7 62.7 90.9 117.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 93.8 50.5 48.5 46.9 °C/W
RθJB Junction-to-board thermal resistance 94.7 42.5 51.5 60.6 °C/W
ψJT Junction-to-top characterization parameter 49.1 30.1 15.9 5.6 °C/W
ψJB Junction-to-case (bottom) thermal resistance 94.3 42.2 51 60 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.