Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
DB|20
NS|20
N|20
DGS|20
DW|20
PW|20
Thermal pad, mechanical data (Package|Pins)
Changes from Revision F (January 2022) to Revision G (July 2022)
Junction-to-ambient thermal resistance values increased. DW was 58 is now 109.1, DB
was 70 is now 122.7, N was 69 is now 84.6, NS was 60 is now 113.4, PW was 83 is now
131.8Go