SCLS886 December   2022 SN74LV164A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings (1)
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: VCC = 2.5 V ± 0.2 V
    7. 6.7  Timing Requirements: VCC = 3.3 V ± 0.3 V
    8. 6.8  Timing Requirements: VCC = 5 V ± 0.5 V
    9. 6.9  Switching Characteristics: VCC = 2.5 V ± 0.2 V
    10. 6.10 Switching Characteristics: VCC = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics: VCC = 5 V ± 0.5 V
    12. 6.12 Noise Characteristics (1)
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74LV164A-Q1UNIT

BQA (WQFN)

14 PINS
RθJAJunction-to-ambient thermal resistance

88.3

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

90.9

RθJBJunction-to-board thermal resistance

56.8

ψJTJunction-to-top characterization parameter

9.9

ψJBJunction-to-board characterization parameter

56.7

RθJC(bot)Junction-to-case (bottom) thermal resistance

33.4

(1) For more information about traditional and new thermal metrics, see IC Package Thermal Metrics