SCLS383R september   1997  – august 2023 SN74LV244A

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Noise Characteristics
    7. 6.7  Operating Characteristics
    8. 6.8  Switching Characteristics: VCC = 2.5 V ± 0.2 V
    9. 6.9  Switching Characteristics: VCC = 3.3 V ± 0.3 V
    10. 6.10 Switching Characteristics: VCC = 5 V ± 0.5 V
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Power Considerations
      2. 9.2.2 Input Considerations
      3. 9.2.3 Output Considerations
      4. 9.2.4 Detailed Design Procedure
      5. 9.2.5 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision Q (March 2023) to Revision R (August 2023)

  • Added DB package and replaced body size with package size in Package Information tableGo
  • Updated thermal values for PW package from RθJA = 102.6 to 128.2, RθJC(top) = 36.7 to 70.5, RθJB = 53.6 to 79.3, ΨJT = 2.4 to 23.4, ΨJB = 53.1 to 78.9, all values in °C/WGo

Changes from Revision P (January 2023) to Revision Q (March 2023)

  • Updated thermal values for DB package from RθJA = 94.7 to 118.2, RθJC(top) = 56.7 to 77.2, RθJB = 49.9 to 73, ΨJT = 18.7 to 42.2, ΨJB = 49.5 to 72.6, all values in °C/WGo
  • Updated thermal values for DW package from RθJA = 79.4 to 102.3 RθJC(top) = 43.8 to 69.9, RθJB = 47.2 to 70.8, ΨJT = 18.8 to 46.4, ΨJB = 46.7 to 70.4, all values in °C/WGo
  • Updated thermal values for NS package from RθJA = 76.9 to 108.1, RθJC(top) = 43.4 to 73.9, RθJB = 44.5 to 73.1, ΨJT = 17.0 to 44.1, ΨJB = 44.1 to 72.8, all values in °C/WGo