SCAS292R January   1993  – May 2024 SN54LVC157A , SN74LVC157A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions, SN54LVC157A
    4. 4.4  Recommended Operating Conditions, SN74LVC157A
    5. 4.5  Thermal Information
    6. 4.6  Electrical Characteristics, SN54LVC157A
    7. 4.7  Electrical Characteristics, SN74LVC157A
    8. 4.8  Switching Characteristics, SN54LVC157A
    9. 4.9  Switching Characteristics, SN74LVC157A
    10. 4.10 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.5 Thermal Information

THERMAL METRIC(1) SN74LVC157A UNIT
BQB (WQFN) D (SOIC) DB (SSOP) NS (SOP) PW (TSSOP) RGY (VQFN)
16
R θJA Junction-to-ambient thermal resistance 98.8 73 82 64 108 39 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.