SCAS292R January   1993  – May 2024 SN54LVC157A , SN74LVC157A

PRODUCTION DATA  

  1.   1
  2. Features
  3. Description
  4. Pin Configuration and Functions
  5. Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions, SN54LVC157A
    4. 4.4  Recommended Operating Conditions, SN74LVC157A
    5. 4.5  Thermal Information
    6. 4.6  Electrical Characteristics, SN54LVC157A
    7. 4.7  Electrical Characteristics, SN74LVC157A
    8. 4.8  Switching Characteristics, SN54LVC157A
    9. 4.9  Switching Characteristics, SN74LVC157A
    10. 4.10 Operating Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

SN54LVC157A SN74LVC157A SN54LVC157A J or W Package, 16-Pin CDIP or CFP; SN74LVC157A D, DB, NS, or, PW Package, 16-Pin
                        SOIC,  SSOP, SOP, or TSSOP (Top View)Figure 3-1 SN54LVC157A J or W Package, 16-Pin CDIP or CFP; SN74LVC157A D, DB, NS, or, PW Package, 16-Pin SOIC, SSOP, SOP, or TSSOP (Top View)
SN54LVC157A SN74LVC157A SN54LVC157A FK Package, 16-Pin LCCC (Top View)Figure 3-3 SN54LVC157A FK Package, 16-Pin LCCC (Top View)
SN54LVC157A SN74LVC157A SN74LVC157A BQB or RGY Package, 16-Pin WQFN or VQFN (Top
                        View)Figure 3-2 SN74LVC157A BQB or RGY Package, 16-Pin WQFN or VQFN (Top View)
Table 3-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A/B 1 I Address select
1A 2 I Channel 1, data input A
1B 3 I Channel 1, data input B
1Y 4 O Channel 1, data output
2A 5 I Channel 2, data input A
2B 6 I Channel 2, data input B
2Y 7 O Channel 2, data output
GND 8 G Ground
3Y 9 O Channel 3, data output
3B 10 I Channel 3, data input B
3A 11 I Channel 3, data input A
4Y 12 O Channel 4, data output
4B 13 I Channel 4, data input B
4A 14 I Channel 4, data input A
G 15 I Output strobe, active low
VCC 16 P Positive supply
Thermal pad(2) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
Signal Types: I = Input, O = Output, I/O = Input or Output, P = Power, G = Ground.
WBQB package only.