Changes from Revision Q (December 2010) to Revision R (May 2024)
- Added BQA package to Package Information table, Pin
Configuration and Functions section, and Thermal Information
tableGo
- Added Device Information table, Pin Functions table,
ESD Ratings table, Thermal Information table, Device
Functional Modes,Application and Implementation section, Device and
Documentation Support section, and Mechanical, Packaging, and
Orderable Information section Go
- Deleted machine model from Features sectionGo