SCES296AE February   2000  – September 2020 SN74LVC1G07

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics, –40°C to 85°C
    7. 6.7 Switching Characteristics, –40°C to 125°C
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 (Open Drain)
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)SN74LVC1G07UNIT
DBVDCKDRLDRYYZPDPW
5 PINS5 PINS5 PINS6 PINS5 PINS4 PINS
RθJAJunction-to-ambient thermal resistance229278243439130340°C/W
RθJC(top)Junction-to-case (top) thermal resistance164937827754215
RθJBJunction-to-board thermal resistance62657827151294
ψJTJunction-to-top characterization parameter4421084141
ψJBJunction-to-board characterization parameter62647727150294
RθJC(bot)Junction-to-case (bottom) thermal resistance–––––250
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.