SCES865C February   2015  – August 2021 SN74LVC1G14-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics, CL = 15 pF
    7. 6.7 Switching Characteristics, CL = 30 pF or 50 pF
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCK|5
  • DRY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (August 2019) to Revision C (August 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the pin numbers for VCC and N.C. in the Pin Functions table for the DRY package to match the pin configurationGo
  • Updated the TPD Across Temperature at 3.3 V VCC image in the Typical Characteristics Go

Changes from Revision A (March 2017) to Revision B (August 2019)

  • Added SON (6) DRY package to Device Information tableGo
  • Added DRY package pinout to Pin Configurations and Functions section Go

Changes from Revision * (February 2015) to Revision A (March 2017)

  • Changed package type to DCK (SC70) and corrected Body Size in Device Information tableGo
  • Deleted θJA from Absolute Maximum Ratings tableGo