SCES424 Data sheet

SCES424M January 2003 – August 2022 SN74LVC1G3157

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

DRY|6
- MPDS221F
DSF|6
- MPDS301G
YZP|6
- MXBG347
DTB|6
- MPSS095B
DCK|6
- MPDS114E
DRL|6
- MPDS159H
DBV|6
- MPDS026Q

Thermal pad, mechanical data (Package|Pins)

DRY|6
- QFND138E

Orderable Information

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage		1.65	5.5	V
V_I/O	Switch input or output voltage		0	V_CC	V
V_IN	Control input voltage		0	5.5	V
V_IH	High-level input voltage, control input	V_CC = 1.65 V to 1.95 V	V_CC × 0.75		V
V_IH	High-level input voltage, control input	V_CC = 2.3 V to 5.5 V	V_CC × 0.7		V
V_IL	Low-level input voltage, control input	V_CC = 1.65 V to 1.95 V		V_CC × 0.25	V
V_IL	Low-level input voltage, control input	V_CC = 2.3 V to 5.5 V		V_CC × 0.3	V
Δt/Δv	Input transition rise or fall rate	V_CC = 1.65 V to 1.95 V		20	ns/V
		V_CC = 2.3 V to 2.7 V		20
		V_CC = 3 V to 3.6 V		10
		V_C_C = 4.5 V to 5.5 V		10
T_A	Operating free-air temperature	BGA package (YZP)	–40	85	°C
T_A	Operating free-air temperature	All other packages (DBV, DCK, DRL, DRY, DSF)	–40	125	°C

(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).