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SN74LVC1G3157

ACTIVE

5-V, 2:1 (SPDT), 1-channel general-purpose analog switch

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Data sheet

SN74LVC1G3157

ACTIVE
Data sheet Order now

Product details

Configuration 2:1 SPDT Number of channels 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 6 CON (typ) (pF) 17.3 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 1 Bandwidth (MHz) 340 Operating temperature range (°C) -40 to 125 Features Break-before-make Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 2:1 SPDT Number of channels 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 6 CON (typ) (pF) 17.3 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 1 Bandwidth (MHz) 340 Operating temperature range (°C) -40 to 125 Features Break-before-make Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
DSBGA (YZP) 6 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 6 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 6 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DSF) 6 1 mm² 1 x 1 X2SON (DTB) 6 0.8 mm² 1 x 0.8
  • ESD protection exceeds JESD 22
    • 2000-V Human Body Model (A114-A)
    • 1000-V Charged-Device Model (C101)
  • 1.65-V to 5.5-V VCC operation
  • Qualified for 125°C operation
  • Specified break-before-make switching
  • Rail-to-rail signal handling
  • Operating frequency typically 340 MHz at room temperature
  • High speed, typically 0.5 ns (VCC = 3 V, CL = 50 pF)
  • Low ON-state resistance, typically ≉6 Ω (VCC = 4.5 V)
  • Latch-up performance exceeds 100 mA Per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 2000-V Human Body Model (A114-A)
    • 1000-V Charged-Device Model (C101)
  • 1.65-V to 5.5-V VCC operation
  • Qualified for 125°C operation
  • Specified break-before-make switching
  • Rail-to-rail signal handling
  • Operating frequency typically 340 MHz at room temperature
  • High speed, typically 0.5 ns (VCC = 3 V, CL = 50 pF)
  • Low ON-state resistance, typically ≉6 Ω (VCC = 4.5 V)
  • Latch-up performance exceeds 100 mA Per JESD 78, class II

This single channel single-pole double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G3157 device can handle both analog and digital signals. The SN74LVC1G3157 device permits signals with amplitudes of up to VCC (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

This single channel single-pole double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G3157 device can handle both analog and digital signals. The SN74LVC1G3157 device permits signals with amplitudes of up to VCC (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.
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Technical documentation

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Type Title Date
* Data sheet SN74LVC1G3157 Single-Pole Double-Throw Analog Switch datasheet (Rev. M) 02 Aug 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
More literature SN74LVC1G3157 and SNS74LVC2G53 SPDT Analog Switches 12 Jun 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

DIP-ADAPTER-EVM — DIP adapter evaluation module

Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)

User guide: PDF
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Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
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Simulation model

HSPICE Model of SN74LVC1G3157

SCEJ160.ZIP (98 KB) - HSpice Model
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Simulation model

SN74LVC1G3157 IBIS Model (Rev. B)

SCEM322B.ZIP (59 KB) - IBIS Model
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Bill of materials (BOM)

Xilinx MGT Rocket I/O Power Supply

SLVR350.PDF (241 KB)
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Many TI reference designs include the SN74LVC1G3157

Use our reference design selection tool to review and identify designs that best match your application and parameters.

View reference designs
Package Pins CAD symbols, footprints & 3D models
DSBGA (YZP) 6 Ultra Librarian
SOT-23 (DBV) 6 Ultra Librarian
SOT-5X3 (DRL) 6 Ultra Librarian
SOT-SC70 (DCK) 6 Ultra Librarian
USON (DRY) 6 Ultra Librarian
X2SON (DSF) 6 Ultra Librarian
X2SON (DTB) 6 Ultra Librarian
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