SLLS059E February   1990  – February 2024 SN751177 , SN751178

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Thermal Information
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Driver Sections
      1. 5.4.1 Electrical Characteristics
      2. 5.4.2 Switching Characteristics
      3. 5.4.3 Symbol Equivalents
    5. 5.5 Receiver Sections
      1. 5.5.1 Electrical Characteristics
      2. 5.5.2 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NS|16
  • N|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 Thermal Information

THERMAL METRIC(1)NNSUNIT
16-PINS16-PINS
R θJAJunction-to-ambient thermal resistance(2)60.688.5°C/W
R θJC(top)Junction-to-case (top) thermal resistance48.146.2°C/W
R θJBJunction-to-board thermal resistance40.650.7°C/W
ψ JTJunction-to-top characterization parameter27.513.5°C/W
ψ JBJunction-to-board characterization parameter40.350.3°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
(2) The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero.