SLLS040I August   1987  – January 2023 SN65ALS176 , SN75ALS176 , SN75ALS176A , SN75ALS176B

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Recommended Operating Conditions
    3. 5.3  Thermal Information
    4. 5.4  Electrical Characteristics - Driver
    5. 5.5  Switching Characteristics - Driver
    6. 5.6  Switching Characteristics - Driver
    7. 5.7  Symbol Equivalents
    8. 5.8  Electrical Characteristics - Receiver
    9. 5.9  Switching Characteristics - Receiver
    10. 5.10 Switching Characteristics - Receiver
    11. 5.11 Typical Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1)P (PDIP)D (SOIC)
SN65 Devices		D (SOIC)
SN75 Devices		UNIT
8-Pins8-Pins

8-Pin

R θJAJunction-to-ambient thermal resistance65.7116.7110°C/W
R θJC(top)Junction-to-case thermal resistance54.756.344.1°C/W
R θJBJunction-to-board thermal resistance42.163.453.5°C/W
ψ JTJunction-to-top characterization parameter238.84.8°C/W
ψ JBJunction-to-board characterization parameter41.762.652.7°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.