SBASB79 November   2024 TAA3020

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 5.9  Switching Characteristics: TDM, I2S or LJ Interface
    10. 5.10 Timing Requirements: PDM Digital Microphone Interface
    11. 5.11 Switching Characteristics: PDM Digial Microphone Interface
    12. 5.12 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configurations
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Programmable Microphone Bias
      6. 6.3.6  Signal-Chain Processing
        1. 6.3.6.1 Programmable Channel Gain and Digital Volume Control
        2. 6.3.6.2 Programmable Channel Gain Calibration
        3. 6.3.6.3 Programmable Channel Phase Calibration
        4. 6.3.6.4 Programmable Digital High-Pass Filter
        5. 6.3.6.5 Programmable Digital Biquad Filters
        6. 6.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 6.3.6.7 Configurable Digital Decimation Filters
          1. 6.3.6.7.1 Linear Phase Filters
            1. 6.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
            2. 6.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
            3. 6.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
            4. 6.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
            5. 6.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
            6. 6.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
            7. 6.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
            8. 6.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
            9. 6.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
          2. 6.3.6.7.2 Low-Latency Filters
            1. 6.3.6.7.2.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 6.3.6.7.2.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 6.3.6.7.2.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 6.3.6.7.2.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 6.3.6.7.2.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 6.3.6.7.2.6 Sampling Rate: 176.4 kHz to 192 kHz
          3. 6.3.6.7.3 Ultra-Low Latency Filters
            1. 6.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 6.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 6.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 6.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 6.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 6.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
            7. 6.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
      7. 6.3.7  Automatic Gain Controller (AGC)
      8. 6.3.8  Voice Activity Detection (VAD)
      9. 6.3.9  Digital PDM Microphone Record Channel
      10. 6.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Active Mode
      3. 6.4.3 Software Reset
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
            1. 6.5.1.1.1.1 I2C Single-Byte and Multiple-Byte Transfers
              1. 6.5.1.1.1.1.1 I2C Single-Byte Write
              2. 6.5.1.1.1.1.2 I2C Multiple-Byte Write
              3. 6.5.1.1.1.1.3 I2C Single-Byte Read
              4. 6.5.1.1.1.1.4 I2C Multiple-Byte Read
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
    2. 7.2 Page_0 Registers
    3. 7.3 Page_1 Registers
    4. 7.4 Programmable Coefficient Registers
      1. 7.4.1 Programmable Coefficient Registers: Page 2
      2. 7.4.2 Programmable Coefficient Registers: Page 3
      3. 7.4.3 Programmable Coefficient Registers: Page 4
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Two-Channel Analog Microphone Recording
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Example Device Register Configuration Script for EVM Setup
      2. 8.2.2 Four-Channel Digital PDM Microphone Recording
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Example Device Register Configuration Script for EVM Setup
    3. 8.3 What to Do and What Not to Do
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

MIN NOM MAX UNIT
POWER
AVDD, AREG(1) Analog supply voltage AVDD to AVSS (AREG is generated using onchip regulator): AVDD 3.3-V operation 3.0 3.3 3.6 V
Analog supply voltage AVDD and AREG to AVSS (AREG internal regulator is shutdown): AVDD 1.8-V operation 1.7 1.8 1.9
IOVDD IO supply voltage to VSS (thermal pad): IOVDD 3.3-V operation 3.0 3.3 3.6 V
IO supply voltage to VSS (thermal pad): IOVDD 1.8-V operation 1.65 1.8 1.95
INPUTS
Analog input pins voltage to AVSS 0 AVDD V
Digital input except IN2P_GPI1 and MICBIAS_GPI2 pins voltage to VSS (thermal pad) 0 IOVDD V
Digital input IN2P_GPI1 and MICBIAS_GPI2 pins voltage to VSS (thermal pad) 0 AVDD V
TEMPERATURE
TA Operating ambient temperature –40 105 °C
OTHERS
GPIOx or GPIx (used as MCLK input) clock frequency 36.864 MHz
Cb SCL and SDA bus capacitance for I2C interface supports standard-mode and fast-mode 400 pF
SCL and SDA bus capacitance for I2C interface supports fast-mode plus 550
CL Digital output load capacitance 20 50 pF
(1) AVSS and VSS (thermal pad): all ground pins must be tied together and must not differ in voltage by more than 0.2 V.