SLASEM6E october   2017  – july 2023 TAS2770

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 TDM Port Timing Requirements
    8. 6.8 PDM Port Timing Requirements
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Mode and Address Selection
      2. 8.3.2 General I2C Operation
      3. 8.3.3 Single-Byte and Multiple-Byte Transfers
      4. 8.3.4 Single-Byte Write
      5. 8.3.5 Multiple-Byte Write and Incremental Multiple-Byte Write
      6. 8.3.6 Single-Byte Read
      7. 8.3.7 Multiple-Byte Read
      8. 8.3.8 Register Organization
    4. 8.4 Device Functional Modes
      1. 8.4.1  PDM Input
      2. 8.4.2  TDM Port
      3. 8.4.3  Playback Signal Path
        1. 8.4.3.1 High Pass Filter
        2. 8.4.3.2 Digital Volume Control and Amplifier Output Level
        3. 8.4.3.3 Audio Playback Selection
        4. 8.4.3.4 Battery Tracking Limiter with Brown Out Prevention
        5. 8.4.3.5 Inter Chip Limiter Alignment
          1. 8.4.3.5.1 TDM Mode
        6. 8.4.3.6 Class-D Settings
      4. 8.4.4  SAR ADC
      5. 8.4.5  IV Sense
      6. 8.4.6  Clocks and PLL
      7. 8.4.7  Operational Modes
        1. 8.4.7.1 Hardware Shutdown
        2. 8.4.7.2 Software Shutdown
        3. 8.4.7.3 Mute
        4. 8.4.7.4 Active
        5. 8.4.7.5 Mode Control and Software Reset
      8. 8.4.8  Faults and Status
      9. 8.4.9  Power Sequencing Requirements
      10. 8.4.10 Digital Input Pull Downs
    5. 8.5 Register Maps
      1. 8.5.1 Register Summary Table Book=0x00 Page=0x00
      2. 8.5.2 Register Maps
        1. 8.5.2.1  PAGE (book=0x00 page=0x00 address=0x00) [reset=0h]
        2. 8.5.2.2  SW_RESET (book=0x00 page=0x00 address=0x01) [reset=0h]
        3. 8.5.2.3  PWR_CTL (book=0x00 page=0x00 address=0x02) [reset=Eh]
        4. 8.5.2.4  PB_CFG0 (book=0x00 page=0x00 address=0x03) [reset=10h]
        5. 8.5.2.5  PB_CFG1 (book=0x00 page=0x00 address=0x04) [reset=1h]
        6. 8.5.2.6  PB_CFG2 (book=0x00 page=0x00 address=0x05) [reset=0h]
        7. 8.5.2.7  PB_CFG3 (book=0x00 page=0x00 address=0x06) [reset=0h]
        8. 8.5.2.8  MISC_CFG (book=0x00 page=0x00 address=0x07) [reset=6h]
        9. 8.5.2.9  PDM_CFG0 (book=0x00 page=0x00 address=0x08) [reset=0h]
        10. 8.5.2.10 PDM_CFG1 (book=0x00 page=0x00 address=0x09) [reset=8h]
        11. 8.5.2.11 TDM_CFG0 (book=0x00 page=0x00 address=0x0A) [reset=7h]
        12. 8.5.2.12 TDM_CFG1 (book=0x00 page=0x00 address=0x0B) [reset=2h]
        13. 8.5.2.13 TDM_CFG2 (book=0x00 page=0x00 address=0x0C) [reset=Ah]
        14. 8.5.2.14 TDM_CFG3 (book=0x00 page=0x00 address=0x0D) [reset=10h]
        15. 8.5.2.15 TDM_CFG4 (book=0x00 page=0x00 address=0x0E) [reset=13h]
        16. 8.5.2.16 TDM_CFG5 (book=0x00 page=0x00 address=0x0F) [reset=2h]
        17. 8.5.2.17 TDM_CFG6 (book=0x00 page=0x00 address=0x10) [reset=0h]
        18. 8.5.2.18 TDM_CFG7 (book=0x00 page=0x00 address=0x11) [reset=4h]
        19. 8.5.2.19 TDM_CFG8 (book=0x00 page=0x00 address=0x12) [reset=6h]
        20. 8.5.2.20 TDM_CFG9 (book=0x00 page=0x00 address=0x13) [reset=7h]
        21. 8.5.2.21 TDM_CFG10 (book=0x00 page=0x00 address=0x14) [reset=8h]
        22. 8.5.2.22 LIM_CFG0 (book=0x00 page=0x00 address=0x15) [reset=14h]
        23. 8.5.2.23 LIM_CFG1 (book=0x00 page=0x00 address=0x16) [reset=76h]
        24. 8.5.2.24 LIM_CFG2 (book=0x00 page=0x00 address=0x17) [reset=10h]
        25. 8.5.2.25 LIM_CFG3 (book=0x00 page=0x00 address=0x18) [reset=6Eh]
        26. 8.5.2.26 LIM_CFG4 (book=0x00 page=0x00 address=0x19) [reset=1Eh]
        27. 8.5.2.27 LIM_CFG5 (book=0x00 page=0x00 address=0x1A) [reset=58h]
        28. 8.5.2.28 BOP_CFG0 (book=0x00 page=0x00 address=0x1B) [reset=1h]
        29. 8.5.2.29 BOP_CFG1 (book=0x00 page=0x00 address=0x1C) [reset=14h]
        30. 8.5.2.30 BOP_CFG2 (book=0x00 page=0x00 address=0x1D) [reset=4Eh]
        31. 8.5.2.31 ICLA_CFG0 (book=0x00 page=0x00 address=0x1E) [reset=0h]
        32. 8.5.2.32 ICLA_CFG1 (book=0x00 page=0x00 address=0x1F) [reset=0h]
        33. 8.5.2.33 INT_MASK0 (book=0x00 page=0x00 address=0x20) [reset=FCh]
        34. 8.5.2.34 INT_MASK1 (book=0x00 page=0x00 address=0x21) [reset=B1h]
        35. 8.5.2.35 INT_LIVE0 (book=0x00 page=0x00 address=0x22) [reset=0h]
        36. 8.5.2.36 INT_LIVE1 (book=0x00 page=0x00 address=0x23) [reset=0h]
        37. 8.5.2.37 INT_LTCH0 (book=0x00 page=0x00 address=0x24) [reset=0h]
        38. 8.5.2.38 INT_LTCH1 (book=0x00 page=0x00 address=0x25) [reset=0h]
        39. 8.5.2.39 INT_LTCH2 (book=0x00 page=0x00 address=0x26) [reset=0h]
        40. 8.5.2.40 VBAT_MSB (book=0x00 page=0x00 address=0x27) [reset=0h]
        41. 8.5.2.41 VBAT_LSB (book=0x00 page=0x00 address=0x28) [reset=0h]
        42. 8.5.2.42 TEMP_MSB (book=0x00 page=0x00 address=0x29) [reset=0h]
        43. 8.5.2.43 TEMP_LSB (book=0x00 page=0x00 address=0x2A) [reset=0h]
        44. 8.5.2.44 INT_CFG (book=0x00 page=0x00 address=0x30) [reset=5h]
        45. 8.5.2.45 DIN_PD (book=0x00 page=0x00 address=0x31) [reset=0h]
        46. 8.5.2.46 MISC_IRQ (book=0x00 page=0x00 address=0x32) [reset=81h]
        47. 8.5.2.47 CLOCK_CFG (book=0x00 page=0x00 address=0x3C) [reset=Dh]
        48. 8.5.2.48 TDM_DET (book=0x00 page=0x00 address=0x77) [reset=7Fh]
        49. 8.5.2.49 REV_ID (book=0x00 page=0x00 address=0x7D) [reset=20h]
        50. 8.5.2.50 I2C_CKSUM (book=0x00 page=0x00 address=0x7E) [reset=0h]
        51. 8.5.2.51 BOOK (book=0x00 page=0x00 address=0x7F) [reset=0h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Overview
        2. 9.2.2.2 Select Input Capacitance
        3. 9.2.2.3 Select Decoupling Capacitors
        4. 9.2.2.4 Select Bootstrap Capacitors
      3. 9.2.3 Application Curves
    3. 9.3 Initialization Set Up
      1. 9.3.1 Initial Device Configuration - Auto Rate
      2. 9.3.2 Initial Device Configuration - 48 kHz
      3. 9.3.3 Initial Device Configuration - 44.1 kHz
      4. 9.3.4 Sample Rate Change - 48 kHz to 44.1kHz
      5. 9.3.5 Sample Rate Change - 44.1 kHz to 48 kHz
      6. 9.3.6 Device Mute
      7. 9.3.7 Device Un-Mute
      8. 9.3.8 Device Sleep
      9. 9.3.9 Device Wake
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TAS2770UNIT
QFN (RJQ)
26 PINS
RθJAJunction-to-ambient thermal resistance57.0°C/W
RθJC(top)Junction-to-case (top) thermal resistance0.3°C/W
RθJBJunction-to-board thermal resistance8.5°C/W
ψJTJunction-to-top characterization parameter0.2°C/W
ψJBJunction-to-board characterization parameter8.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceNA°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.