SLES239A November   2008  – December 2016 TAS5352A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Audio Specifications (BTL)
    7. 6.7 Audio Specifications (Single-Ended Output)
    8. 6.8 Audio Specifications (PBTL)
    9. 6.9 Typical Characteristics
      1. 6.9.1 BTL Configuration
      2. 6.9.2 SE Configuration
      3. 6.9.3 PBTL Configuration
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 System Power-Up and Power-Down Sequence
        1. 7.3.1.1 Powering Up
        2. 7.3.1.2 Powering Down
      2. 7.3.2 Mid Z Sequence Compatibility
      3. 7.3.3 Error Reporting
      4. 7.3.4 Device Protection System
        1. 7.3.4.1 Use of TAS5352A in High-Modulation-Index Capable Systems
        2. 7.3.4.2 Overcurrent (OC) Protection With Current Limiting and Overload Detection
        3. 7.3.4.3 Pin-to-Pin Short-Circuit Protection (PPSC)
        4. 7.3.4.4 Overtemperature Protection
        5. 7.3.4.5 Undervoltage Protection (UVP) and Power-On-Reset (POR)
      5. 7.3.5 Device Reset
    4. 7.4 Device Functional Modes
      1. 7.4.1 Protection MODE Selection Pins
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 BTL Application With AD Modulation Filters - 2N
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 PCB Material Recommendation
          2. 8.2.1.2.2 PVDD Capacitor Recommendation
          3. 8.2.1.2.3 Decoupling Capacitor Recommendations
        3. 8.2.1.3 Application Curves
      2. 8.2.2 BTL Application With AD Modulation Filters - 1N
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 SE Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Application Curves
      4. 8.2.4 PBTL Application With AD Modulation Filters
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Application Curves
      5. 8.2.5 Non-Differential PBTL Application
        1. 8.2.5.1 Design Requirements
    3. 8.3 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (November 2008) to A Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information table, see POA at the end of this data sheetGo
  • Deleted Package Heat Dissipation Ratings tableGo
  • Updated values in the Thermal Information table to align with JEDEC standards Go