SLOS918A August   2015  – October 2015 TAS5404-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements for I2C Interface Signals
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Descption
      1. 9.3.1  Preamplifier
      2. 9.3.2  Pulse-Width Modulator (PWM)
      3. 9.3.3  Gate Drive
      4. 9.3.4  Power FETs
      5. 9.3.5  Load Diagnostics
      6. 9.3.6  Protection and Monitoring
      7. 9.3.7  I2C Serial Communication Bus
      8. 9.3.8  I2C Bus Protocol
      9. 9.3.9  Hardware Control Pins
      10. 9.3.10 AM Radio Avoidance
    4. 9.4 Device Functional Modes
      1. 9.4.1 Audio Shutdown and Restart Sequence
      2. 9.4.2 Latched-Fault Shutdown and Restart Sequence Control
    5. 9.5 Programming
      1. 9.5.1 Random Write
      2. 9.5.2 Sequential Write
      3. 9.5.3 Random Read
      4. 9.5.4 Sequential Read
    6. 9.6 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Hardware and Software Design
        2. 10.2.2.2 Parallel Operation (PBTL)
        3. 10.2.2.3 Input Filter Design
        4. 10.2.2.4 Amplifier Output Filtering
        5. 10.2.2.5 Line Driver Applications
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Consideration
    4. 12.4 Electrical Connection of Heat Slug and Heat Sink
    5. 12.5 EMI Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.