SLOS795F September   2013  – October 2017 TAS5414C-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for I2C Interface Signals
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descption
      1. 7.3.1  Preamplifier
      2. 7.3.2  Pulse-Width Modulator (PWM)
      3. 7.3.3  Gate Drive
      4. 7.3.4  Power FETs
      5. 7.3.5  Load Diagnostics
      6. 7.3.6  Protection and Monitoring
      7. 7.3.7  I2C Serial Communication Bus
      8. 7.3.8  I2C Bus Protocol
      9. 7.3.9  Hardware Control Pins
      10. 7.3.10 AM Radio Avoidance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Audio Shutdown and Restart Sequence
      2. 7.4.2 Latched-Fault Shutdown and Restart Sequence Control
    5. 7.5 Programming
      1. 7.5.1 Random Write
      2. 7.5.2 Sequential Write
      3. 7.5.3 Random Read
      4. 7.5.4 Sequential Read
    6. 7.6 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Hardware and Software Design
        2. 8.2.2.2 Parallel Operation (PBTL)
        3. 8.2.2.3 Input Filter Design
        4. 8.2.2.4 Amplifier Output Filtering
        5. 8.2.2.5 Line Driver Applications
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
    4. 10.4 Electrical Connection of Heat Slug and Heat Sink
    5. 10.5 EMI Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PHD|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

Application Information

The TAS5414C-Q1 and TAS5424C-Q1 are four-channel digital audio amplifiers designed for use in automotive head units and external amplifier modules. The device incorporates all the functionality needed to perform in the demanding OEM applications area.

Typical Application

Figure 21 shows a typical application circuit for the TAS5414C-Q1.

TAS5414C-Q1 TAS5424C-Q1 TAS5414_AppDiagram.png Figure 21. TAS5414C-Q1 Typical Application Schematic

Design Requirements

  • Power Supplies
  • The device needs only a single power supply compliant with the recommended operation range. The device is designed to work with either a vehicle battery or regulated boost power supply.

  • Communication
  • The device communicates with the system controller with both discrete hardware control pins and with I 2 C. The device is an I 2 C slave and thus requires a master. If a master I 2 C-compliant device is not present in the system, it is still possible to use the device, but only with the default settings. Diagnostic information is limited to the discrete reporting FAULT pin.

  • External Components
  • Table 24 lists the components required for the device.

    Table 24. Supporting Components

    EVM Designator Quanity Value Size Description Use in Application
    C37, C39, C48, C52 4 0.47μF ± 10% 1206 Film, 16-V Analog audio input filter, bypass
    C5, C6, C7, C8 4 330 μF ± 20% 10 mm Low-ESR aluminum capacitor, 35-V Power supply
    C9, C10, C50, C51, C27, C28 6 1 μF ± 10% 0805 X7R ceramic capacitor, 50-V Power supply
    C53, C55 2 1uF ± 10% 0805 Film, 16-V Analog audio input filter, bypass
    C14, C23, C32, C43 4 470nF ± 10% 0805 X7R ceramic capacitor, 50-V Amplifier output filtering
    C11, C15, C20, C24, C29, C34, C40, C45 8 470 pF ± 10% 0603 X7R ceramic capacitor, 50-V Amplifier output snubbers
    C19, C33 2 0.1 μF ± 10% 0603 X7R ceramic capacitor, 25-V Power supply
    C4 1 2200 pF ± 10% 0603 X7R ceramic capacitor, 50-V Power supply
    C3 1 0.082 μF ± 10% 0603 X7R ceramic capacitor, 25-V Power supply
    C1, C2 2 4.7 μF ± 10% 1206 X7R ceramic capacitor, 25-V Power supply
    C12, C16, C21, C25, C30, C35, C41, C46 8 0.47 μF ± 10% 0603 X7R ceramic capacitor, 25-V Output EMI filtering
    C18 1 220nF ± 10% 0603 X7R ceramic capacitor, 25-V Mute timing
    L1 1 10 μH ± 20% 13.5 mm ×13.5 mm Shielded ferrite inductor Power supply
    L2, L3, L4, L5 4 10 μH ± 20% 12 mm × 14 mm Dual inductor Amplifier output filtering
    R5, R6, R7 3 49.9 kΩ ± 1% 0805 Resistors, 0.125-W Analog audio input filter
    R8, R10, R12, R14, R17, R19, R26, R29 8 5.6 Ω ± 5% 0805 Resistors, 0.125-W Output snubbers
    R16 1 20.0 kΩ ± 1% 0805 Resistors, 0.125-W Power supply

Detailed Design Procedure

Hardware and Software Design

  • Step 1: Hardware Schematic Design: Using the Typical Application Schematic as a guide, integrate the hardware into the system schematic.
  • Step 2: Following the recommended layout guidelines, integrate the device and its supporting components into the system PCB file.
  • Step 3: Thermal Design: The device has an exposed thermal pad which requires proper soldering. For more information, see the Semiconductor and IC Package Thermal Metrics , SPRA953, and the PowerPAD Thermally Enhanced Package, SLMA002G, application reports.
  • Step 4: Develop software: The EVM User's Guide has detailed instructions for how to set up the device, interpret diagnostic information, and so forth. For information about control registers, see the Table 7 section.
  • For questions and support go to the E2E forums.

Parallel Operation (PBTL)

The device can drive more current by paralleling BTL channels on the load side of the LC output filter. Parallel operation requires identical I2C settings for any two paralleled channels in order to have reliable system performance and even power dissipation on multiple channels. For smooth power up, power down, and mute operation, the same control commands (such as mute, play, Hi-Z, and so on) should be sent to the paralleled channels at the same time. The device also supports load diagnostics for parallel connection. There is no support for paralleling on the device side of the LC output filter, which can result in device failure. When paralleling channels, use the parallel BTL I2C control bits in register 0x0D. Parallel channels 1 and 2, and/or channels 3 and 4. Setting these bits allows the thermal foldback to react on both channels equally. Provide the audio input to channel 2 if paralleing channels 1 and 2, and channel 3 if paralleling channels 3 and 4.

Input Filter Design

For the TAS5424C-Q1 device, the input filters for the P and M inputs of a single channel should be identical. For the TAS5414C-Q1, the IN_M pin should have an impedance to GND that is equivalent to the parallel combination of the input impedances of all IN_P channels combined, including any source impedance from the previous stage in the system design. For example, if each of the four IN_P channels have a 1-µF dc blocking capacitor, 1 kΩ of series resistance due to an input RC filter, and 1 kΩ of source resistance from the DAC supplying the audio signal, then the IN_M channel should have a 4-µF capacitor in series with a 500-Ω resistor to GND (4 × 1 µF in parallel = 4 µF; 4 × 2 kΩ in parallel = 500 Ω).

Amplifier Output Filtering

The output FETs drive the amplifier outputs in an H-bridge configuration. These transistors are either fully off or on. The result is a square-wave output signal with a duty cycle that is proportional to the amplitude of the audio signal. The amplifier outputs require a low-pass filter to filter out the PWM modulation carrier frequency. People frequently call this filter the L-C filter, due to the presence of an inductive element L and a capacitive element C to make up the 2-pole low-pass filter. The L-C filter attenuates the carrier frequency, reducing electromagnetic emissions and smoothing the current waveform which the load draws from the power supply. See the Class-D LC Filter Design application report, SLOA119 , for a detailed description on proper component selection and design of an L-C filter based upon the desired load and response.

Line Driver Applications

In many automotive audio applications, the end user would like to use the same head unit to drive either a speaker (with several ohms of impedance) or an external amplifier (with several kilohms of impedance). The design is capable of supporting both applications; however, the one must design the output filter and system to handle the expected output load conditions.

Application Curves

TAS5414C-Q1 TAS5424C-Q1 G007_LOS514.gif Figure 22. Efficiency
Four Channels AT 4 Ω Each
TAS5414C-Q1 TAS5424C-Q1 G008_LOS514.gif Figure 23. Device Power Dissipation
Four Channels at 4 Ω Each