SLASF99 December   2023 TAS5827

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
      1. 5.7.1 Bridge Tied Load (BTL) Configuration Curves with BD Modulation
      2. 5.7.2 Bridge Tied Load (BTL) Configuration Curves with 1SPW Modulation
      3. 5.7.3 Parallel Bridge Tied Load (PBTL) Configuration With BD Modulation
      4. 5.7.4 Parallel Bridge Tied Load (PBTL) Configuration With 1SPW Modulation
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Supplies
      2. 6.3.2 Device Clocking
      3. 6.3.3 Serial Audio Port – Clock Rates
      4. 6.3.4 Clock Halt Auto-recovery
      5. 6.3.5 Sample Rate on the Fly Change
      6. 6.3.6 Serial Audio Port - Data Formats and Bit Depths
    4. 6.4 Device Functional Modes
      1. 6.4.1 Software Control
      2. 6.4.2 Speaker Amplifier Operating Modes
        1. 6.4.2.1 BTL Mode
        2. 6.4.2.2 PBTL Mode
      3. 6.4.3 Low EMI Modes
        1. 6.4.3.1 Spread Spectrum
        2. 6.4.3.2 Channel to Channel Phase Shift
        3. 6.4.3.3 Multi-Devices PWM Phase Synchronization
          1. 6.4.3.3.1 Phase Synchronization With I2S Clock In Startup Phase
          2. 6.4.3.3.2 Phase Synchronization With GPIO
      4. 6.4.4 Thermal Foldback
      5. 6.4.5 Device State Control
      6. 6.4.6 Device Modulation
        1. 6.4.6.1 BD Modulation
        2. 6.4.6.2 1SPW Modulation
        3. 6.4.6.3 Hybrid Modulation
      7. 6.4.7 Programming and Control
        1. 6.4.7.1 I2C Serial Communication Bus
        2. 6.4.7.2 Hardware Control Mode
        3. 6.4.7.3 I2C Target Address
          1. 6.4.7.3.1 Random Write
          2. 6.4.7.3.2 Sequential Write
          3. 6.4.7.3.3 Random Read
          4. 6.4.7.3.4 Sequential Read
          5. 6.4.7.3.5 DSP Memory Book, Page and BQ update
          6. 6.4.7.3.6 Checksum
            1. 6.4.7.3.6.1 Cyclic Redundancy Check (CRC) Checksum
            2. 6.4.7.3.6.2 Exclusive or (XOR) Checksum
        4. 6.4.7.4 Control via Software
          1. 6.4.7.4.1 Startup Procedures
          2. 6.4.7.4.2 Shutdown Procedures
        5. 6.4.7.5 Protection and Monitoring
          1. 6.4.7.5.1 Overcurrent Limit (Cycle-By-Cycle)
          2. 6.4.7.5.2 Overcurrent Shutdown (OCSD)
          3. 6.4.7.5.3 DC Detect Error
          4. 6.4.7.5.4 Overtemperature Shutdown (OTSD)
          5. 6.4.7.5.5 PVDD Overvoltage and Undervoltage Error
          6. 6.4.7.5.6 PVDD Drop Detection
          7. 6.4.7.5.7 Clock Fault
    5. 6.5 Register Maps
      1. 6.5.1 reg_map Registers
  8. 7 Application and Implementation
    1. 7.1 Typical Applications
      1. 7.1.1 2.0 (Stereo BTL) System
      2. 7.1.2 Mono (PBTL) Systems
      3. 7.1.3 Layout Guidelines
        1. 7.1.3.1 General Guidelines for Audio Amplifiers
        2. 7.1.3.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
        3. 7.1.3.3 Optimizing Thermal Performance
          1. 7.1.3.3.1 Device, Copper, and Component Layout
          2. 7.1.3.3.2 Stencil Pattern
          3. 7.1.3.3.3 PCB footprint and Via Arrangement
          4. 7.1.3.3.4 Solder Stencil
        4. 7.1.3.4 Layout Example
  9. 8 Power Supply Recommendations
    1. 8.1 DVDD Supply
    2. 8.2 PVDD Supply
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Development Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-13B7954F-330B-408E-B307-308B9F3CA42A-low.svg Figure 4-1 RHB (VQFN) Package, 32-Pin PadDown, Software Mode, Top View
Table 4-1 Pin Functions - Software Mode
PIN TYPE(1) DESCRIPTION
NAME NO.
ADR 8 DI A table of resistor value (Pull down to GND) decides the device I2C address. See Table 6-5.
AGND 20 G Analog ground.
AVDD 19 P Internally regulated 5-V analog supply voltage. This pin must not be used to drive external devices.
BST_A+ 1 P Connection point for the OUT_A+ bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_A+.
BST_A- 29 P Connection point for the OUT_A- bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_A-.
BST_B+ 24 P Connection point for the OUT_B+ bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_B+.
BST_B- 28 P Connection point for the OUT_B- bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_B-.
DGND 5 G Digital ground.
DVDD 6 P 3.3-V or 1.8-V digital power supply.
GPIO0 9 DI/O General-purpose input/output, function of this pin can be programmed by register (Register Address 0x60h and 0x61h). Can be configured to be open drain output or push-pull output.
GPIO1 10 DI/O General-purpose input/output, function of this pin can be programmed by register (Register Address 0x60h and 0x62h). Can be configured to be open drain output or push-pull output.
GPIO2 11 DI/O General-purpose input/output, function of this pin can be programmed by register (Register Address 0x60h and 0x63h). Can be configured to be open drain output or push-pull output.
LRCLK 12 DI Word select clock for the digital signal that is active on the serial port's input data line. In I2S, LJ and RJ, this corresponds to the left channel and right channel boundary. In TDM mode, this corresponds to the frame sync boundary.
OUT_A+ 2 PO Positive pin for differential speaker amplifier output A.
OUT_A- 30 NO Negative pin for differential speaker amplifier output A.
OUT_B+ 23 PO Positive pin for differential speaker amplifier output B.
OUT_B- 27 NO Negative pin for differential speaker amplifier output B.
PDN 17 DI Power down, active-low. PDN place the amplifier in Shutdown, turn off all internal regulators.
PGND 25 G Ground reference for power device circuitry. Connect this pin to system ground.
26 G
31 G
32 G
PVDD 3 P PVDD voltage input.
4 P
21 P
22 P
SDA 15 DI/O I2C serial control data interface input/output.
SDIN 14 DI Data line to the serial data port.
SCL 16 DI I2C serial control clock input.
SCLK 13 DI Bit clock for the digital signal that is active on the input data line of the serial data port.
VR_DIG 7 P Internally regulated 1.5-V digital supply voltage. This pin must not be used to drive external devices.
PowerPAD™ G Ground, connect to grounded heat sink for best system performance.
(1) AI = Analog input, AO = Analog output, DI = Digital Input, DO = Digital Output, DI/O = Digital Bi-directional (input and output), PO = Positive output, NO = Negative output, P = Power, G = Ground (0 V)
GUID-86C503A8-2C59-4A54-B870-54C3872A24FB-low.svg Figure 4-2 RHB (VQFN) Package, 32-Pin PadDown, Hardware Mode,Top View
Table 4-2 Pin Functions - Hardware Mode
PIN TYPE(1) DESCRIPTION
NAME NO.
AGND 20 G Analog ground.
AVDD 19 P Internally regulated 5-V analog supply voltage. This pin must not be used to drive external devices.
BST_A+ 1 P Connection point for the OUT_A+ bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_A+.
BST_A- 29 P Connection point for the OUT_A- bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_A-.
BST_B+ 24 P Connection point for the OUT_B+ bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_B+.
BST_B- 28 P Connection point for the OUT_B- bootstrap capacitor which is used to create a power supply for the high-side gate drive for OUT_B-.
DGND 5 G Digital ground.
DVDD 6 P 3.3-V or 1.8-V digital power supply.
FAULT 10 DO Fault terminal,which is pulled LOW when an internal fault occurs.
GVDD 18 P Gate drive internal regulator output. This pin must not be used to drive external devices.
HW_MODE 8 DI Connect to DVDD directly to ensure device enter into Hardware Control Mode.
HW_SEL0 16 DI Analog gain and BTL/PBTL mode selection in Hardware Mode . Pull up to DVDD or Pull down to ground with different resistor. See Table 6-4.
HW_SEL1 15 DI PWM Switching Frequency and Spread Spectrum Enable/Disable selection in Hardware Mode. Pull up to DVDD or Pull down to ground with different resistor. See Table 6-3.
LRCLK 12 DI Word select clock for the digital signal that is active on the serial port's input data line. In I2S, LJ and RJ, this corresponds to the left channel and right channel boundary. In TDM mode, this corresponds to the frame sync boundary.
MUTE 11 DI Speaker amplifier Mute. Which must be pulled low (connect to DGND) to MUTE the device and pulled high (connected to DVDD) to exit MUTE state. In Mute state, device output keep in Hi-Z state.
OUT_A+ 2 PO Positive pin for differential speaker amplifier output A.
OUT_A- 30 NO Negative pin for differential speaker amplifier output A.
OUT_B+ 23 PO Positive pin for differential speaker amplifier output B.
OUT_B- 27 NO Negative pin for differential speaker amplifier output B.
PD_DET 9 DO PVDD Drop detection, which is pulled LOW when the PVDD drop below 8V.
PDN 17 DI Power down, active-low. PDN place the amplifier in Shutdown, turn off all internal regulators.
PGND 25 G Ground reference for power device circuitry. Connect this pin to system ground.
26 G
31 G
32 G
PVDD 3 P PVDD voltage input.
4 P
21 P
22 P
SCLK 13 DI Bit clock for the digital signal that is active on the input data line of the serial data port.
SDIN 14 DI Data line to the serial data port.
VR_DIG 7 P Internally regulated 1.5-V digital supply voltage. This pin must not be used to drive external devices.
PowerPAD™ G Ground, connect to grounded heat sink for best system performance.
(1) AI = Analog input, AO = Analog output, DI = Digital Input, DO = Digital Output, DI/O = Digital Bi-directional (input and output), PO = Positive output, NO = Negative output, P = Power, G = Ground (0 V)