SLLSFL9A July   2021  – December 2021 TCAN1046A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings — IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Characteristics
    6. 6.6  Supply Characteristics
    7. 6.7  Dissipation Ratings
    8. 6.8  Electrical Characteristics
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Description
        1. 8.3.1.1 TXD1 and TXD2
        2. 8.3.1.2 GND1 and GND2
        3. 8.3.1.3 VCC1 and VCC2
        4. 8.3.1.4 RXD1 and RXD2
        5. 8.3.1.5 CANH1, CANL1, CANH2, and CANL1
        6. 8.3.1.6 STB1 and STB2 (Standby)
      2. 8.3.2 CAN Bus States
      3. 8.3.3 TXD Dominant Timeout (DTO)
      4. 8.3.4 CAN Bus Short-Circuit Current Limiting
      5. 8.3.5 Thermal Shutdown (TSD)
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Unpowered Device
      8. 8.3.8 Floating pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
      2. 8.4.2 Normal Mode
      3. 8.4.3 Standby Mode
        1. 8.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 8.4.4 Driver and Receiver Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 CAN Termination
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 D Package, 14 Pin SOIC, Top View
Figure 5-2 DMT Package, 14 Pin VSON, Top View
Table 5-1 Pin Functions
Pins Type Description
Name No.
TXD1 1 Digital Input CAN transmit data input channel 1; integrated pull-up
GND1 2 GND1 Ground connection, channel 1
VCC1 3 Supply 5-V supply voltage, channel 1
RXD1 4 Digital Output CAN receive data output channel 1; tri-state when VCC < UVVCC
TXD2 5 Digital Input CAN transmit data input channel 2; integrated pull-up
GND2 6 GND2 Ground connection, channel 2
VCC2 7 Supply 5-V supply voltage, channel 2
RXD2 8 Digital Output CAN receive data output channel 2; tri-state when VCC < UVVCC
CANL2 9 Bus IO Low-level CAN bus channel 2 input/output line
CANH2 10 Bus IO High-level CAN bus 2 input/output line
STB2 11 Digital Input Standby input of channel 2 for mode control; integrated pull-up
CANL1 12 Bus IO Low-level CAN bus channel 1 input/output line
CANH1 13 Bus IO High-level CAN bus channel 1 input/output line
STB1 14 Digital Input Standby input of channel 1 for mode control; integrated pull-up
Thermal Pad (VSON only) — Connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief