SLLSFV9 July   2024 TCAN1473-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings - IEC Specifications
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation Ratings
    7. 5.7  Power Supply Characteristics
    8. 5.8  Electrical Characteristics
    9. 5.9  Timing Requirements
    10. 5.10 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Signal Improvement
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supply Pins
        1. 7.3.1.1 VSUP Pin
        2. 7.3.1.2 VCC Pin
        3. 7.3.1.3 VIO Pin
      2. 7.3.2 Digital Inputs and Outputs
        1. 7.3.2.1 TXD Pin
        2. 7.3.2.2 RXD Pin
        3. 7.3.2.3 nFAULT Pin
        4. 7.3.2.4 EN Pin
        5. 7.3.2.5 nSTB Pin
      3. 7.3.3 GND
      4. 7.3.4 INH Pin
      5. 7.3.5 WAKE Pin
      6. 7.3.6 CAN Bus Pins
      7. 7.3.7 Faults
        1. 7.3.7.1 Internal and External Fault Indicators
          1. 7.3.7.1.1 Power-Up (PWRON Flag)
          2. 7.3.7.1.2 Wake-Up Request (WAKERQ Flag)
          3. 7.3.7.1.3 Undervoltage Faults
            1. 7.3.7.1.3.1 Undervoltage on VSUP
            2. 7.3.7.1.3.2 Undervoltage on VCC
            3. 7.3.7.1.3.3 Undervoltage on VIO
          4. 7.3.7.1.4 CAN Bus Fault (CBF Flag)
          5. 7.3.7.1.5 TXD Dominant State Timeout (TXDDTO Flag)
          6. 7.3.7.1.6 TXD Shorted to RXD Fault (TXDRXD Flag)
          7. 7.3.7.1.7 CAN Bus Dominant Fault (CANDOM Flag)
      8. 7.3.8 Local Faults
        1. 7.3.8.1 TXD Dominant Timeout (TXD DTO)
        2. 7.3.8.2 Thermal Shutdown (TSD)
        3. 7.3.8.3 Undervoltage Lockout (UVLO)
        4. 7.3.8.4 Unpowered Devices
        5. 7.3.8.5 Floating Terminals
        6. 7.3.8.6 CAN Bus Short-Circuit Current Limiting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Mode Description
        1. 7.4.1.1 Normal Mode
        2. 7.4.1.2 Silent Mode
        3. 7.4.1.3 Standby Mode
        4. 7.4.1.4 Go-To-Sleep Mode
        5. 7.4.1.5 Sleep Mode
          1. 7.4.1.5.1 Remote Wake Request via Wake-Up Pattern (WUP)
          2. 7.4.1.5.2 Local Wake-Up (LWU) via WAKE Input Terminal
      2. 7.4.2 CAN Transceiver
        1. 7.4.2.1 CAN Transceiver Operation
          1. 7.4.2.1.1 CAN Transceiver Modes
            1. 7.4.2.1.1.1 CAN Off Mode
            2. 7.4.2.1.1.2 CAN Autonomous: Inactive and Active
            3. 7.4.2.1.1.3 CAN Active
          2. 7.4.2.1.2 Driver and Receiver Function Tables
          3. 7.4.2.1.3 CAN Bus States
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
      2. 8.1.2 Design Requirements
        1. 8.1.2.1 Bus Loading, Length and Number of Nodes
      3. 8.1.3 Detailed Design Procedure
        1. 8.1.3.1 CAN Termination
      4. 8.1.4 Application Curves
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
      1. 11.1.1 Packaging Information
      2. 11.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1.1 Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish(4) MSL Peak Temp (3) Op Temp (°C) Device Marking(5)(6)
TCAN1473DYYRQ1 PREVIEW SOT-23-THN DYY 14 3000 RoHS & Green NIPDAU Call TI -40 to 125 TCAN1473
TCAN1473DRQ1 PREVIEW SOIC D 14 2500 RoHS & Green NIPDAU Call TI -40 to 125 TCAN1473
TCAN1473DMTRQ1 PREVIEW VSON DMT 14 3000 RoHS & Green NIPDAU Call TI -40 to 125 TCAN1473
PTCAN1473DYYRQ1 ACTIVE SOT-23-THN DYY 14 3000 RoHS & Green NIPDAU Call TI -40 to 125 PTCAN1473
PTCAN1473DRQ1 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Call TI -40 to 125 PTCAN1473
PTCAN1473DMTRQ1 ACTIVE VSON DMT 14 3000 RoHS & Green NIPDAU Call TI -40 to 125 PTCAN1473
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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