SLLSEQ7E December   2015  – December 2019 TCAN330 , TCAN330G , TCAN332 , TCAN332G , TCAN334 , TCAN334G , TCAN337 , TCAN337G

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Block Diagram
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
    8. 8.8 Typical Characteristics, TCAN330 Receiver
    9. 8.9 Typical Characteristics, TCAN330 Driver
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 TXD Dominant Timeout (TXD DTO)
      2. 10.3.2 RXD Dominant Timeout (RXD DTO)
      3. 10.3.3 Thermal Shutdown
      4. 10.3.4 Undervoltage Lockout and Unpowered Device
      5. 10.3.5 Fault Pin (TCAN337)
      6. 10.3.6 Floating Pins
      7. 10.3.7 CAN Bus Short Circuit Current Limiting
      8. 10.3.8 ESD Protection
      9. 10.3.9 Digital Inputs and Outputs
    4. 10.4 Device Functional Modes
      1. 10.4.1 CAN Bus States
      2. 10.4.2 Normal Mode
      3. 10.4.3 Silent Mode
      4. 10.4.4 Standby Mode with Wake
      5. 10.4.5 Bus Wake via RXD Request (BWRR) in Standby Mode
      6. 10.4.6 Shutdown Mode
      7. 10.4.7 Driver and Receiver Function Tables
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 Bus Loading, Length and Number of Nodes
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 CAN Termination
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 System Examples
      1. 11.3.1 ISO11898 Compliance of TCAN33x Family of 3.3-V CAN Transceivers Introduction
      2. 11.3.2 Differential Signal
      3. 11.3.3 Common-Mode Signal and EMC Performance
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Related Links
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.