SLDS120H March   2000  – March 2022 TFP401 , TFP401A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings (1)
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Digital I/O Electrical Characteristics
    6. 7.6 DC Electrical Characteristics
    7. 7.7 AC Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TMDS Pixel Data and Control Signal Encoding
      2. 9.3.2 TFP401/401A Clocking and Data Synchronization
      3. 9.3.3 TFP401/401A TMDS Input Levels and Input Impedance Matching
      4. 9.3.4 TFP401A Incorporates HSYNC Jitter Immunity
    4. 9.4 Device Functional Modes
      1. 9.4.1 TFP401/401A Modes of Operation
      2. 9.4.2 TFP401/401A Output Driver Configurations
        1. 9.4.2.1 Output Driver Power Down
        2. 9.4.2.2 Drive Strength
        3. 9.4.2.3 Time-Staggered Pixel Output
        4. 9.4.2.4 Power Management
        5. 9.4.2.5 Sync Detect
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Data and Control Signals
        2. 10.2.2.2 Configuration Options
        3. 10.2.2.3 Power Supplies Decoupling
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Layer Stack
      2. 12.1.2 Routing High-Speed Differential Signal Traces (RxC–, RxC+, Rx0–, Rx0+, Rx1–, Rx1+, Rx2–, Rx2+)
      3. 12.1.3 DVI Connector
    2. 12.2 Layout Example
    3. 12.3 TI PowerPAD 100-TQFP Package
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.2.3 Time-Staggered Pixel Output

This option works only in conjunction with the 2-pixel/clock mode (PIXS = high). Setting STAG = low time-staggers the even- and odd-pixel outputs so as to reduce the amount of instantaneous current surge from the power supply. Depending on the PCB layout and design, this can help reduce the amount of system ground bounce and power-supply noise. The time stagger is such that in 2-pixel/clock mode, the even pixel is delayed from the latching edge of ODCK by 0.25 tcip. (tcip is the period of ODCK. The ODCK period is 2 tpix when in 2-pixel/clock mode).

Depending on system constraints of output load, pixel rate, panel input architecture, and board cost, the TFP401/401A drive-strength and staggered-pixel options allow flexibility to reduce system power-supply noise, ground bounce, and EMI.