Use solid ground planes and tie ground
planes together with as many vias as is practical. This will provide a desirable
return path for current. Each supply should be on separate split power planes, where
each power plane should be as large an area as possible. Connect PanelBus receiver
power and ground pins and all bypass caps to appropriate power or ground plane with
via. Vias should be as fat and short as practical, the goal is to minimize the
inductance.
- DVDD: Place one 0.01
µF capacitor as close as possible between each DVDD device pin (Pins 6, 38,
and 67) and ground. A 22 µF tantalum capacitor should be placed between the
supply and 0.01 µF capacitors. A ferrite bead should be used between the
source and the 22 µF capacitor.
- OVDD: Place one 0.01
µF capacitor as close as possible between each OVDD device pin (Pins 18, 29,
43, 57, and 78) and ground. A 22 µF tantalum capacitor should be placed
between the supply and 0.01 µF capacitors. A ferrite bead should be used
between the source and the 22 µF capacitor.
- AVDD: Place one 0.01
µF capacitor as close as possible between each AVDD device pin (Pins 82, 84,
88, and 95) and ground. A 22 µF tantalum capacitor should be placed between
the supply and 0.01 µF capacitors. A ferrite bead should be used between the
source and the 22 µF capacitor.
- PVCC: Place three 0.01
µF capacitors in parallel as close as possible between the PVDD device pin
(Pin 97) and ground. A 22 µF tantalum capacitor should be placed between the
supply and 0.01 µF capacitors. A ferrite bead should be used between the
source and the 22 µF capacitor.