SLDS120H March 2000 – March 2022 TFP401 , TFP401A
PRODUCTION DATA
The pinout of Texas Instruments' High Speed Interface (HSI) devices features differential signal pairs and the remaining signals comprise the supply rails, VCC and ground, and lower speed signals such as control pins. As an example, consider a device X which is a repeater/re-driver, so both its inputs and outputs are high-speed differential signals. These guidelines can be applied to other high-speed devices such as drivers, receivers, multiplexers, and so forth. A minimum of four layers is required to accomplish a low EMI PCB design. Layer stacking should be in the following order (top-to-bottom): high-speed differential signal layer, ground plane, power plane and control signal layer.