SLOS217I July   1998  – December 2024 THS3001

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Feedback and Gain Resistor Values
      2. 7.1.2 Noise Calculations
      3. 7.1.3 Slew Rate
      4. 7.1.4 Offset Voltage
    2. 7.2 Typical Applications
      1. 7.2.1 General Configurations
      2. 7.2.2 Driving a Capacitive Load
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Design Considerations
        2. 7.4.1.2 Thermal Considerations
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Evaluation Board
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision H (September 2009) to Revision I (December 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the Pin Configuration and Functions, Specifications, ESD Ratings, Recommended Operating Conditions, Thermal Information, Detailed Description, Overview, Functional Block Diagram, Device Functional Modes, Application and Implementation, Typical Applications, Power Supply Recommendations, Layout, Layout Guidelines, Thermal Considerations, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Updated table note 1 on Absolute Maximum Ratings to add additional clarification.Go
  • Deleted THS3001HV from Absolute Maximum Ratings.Go
  • Deleted THS3001HV from Recommended Operating Conditions Go
  • Updated Recommended Operating Conditions with nominal valuesGo
  • Changed Vss to Vcc in Recommended Operating Conditions to maintain consistency with Absolute Maximum Ratings Go
  • Moved Operating Characteristics to be included in Electrical Characteristics Go
  • Changed bandwidth for 0.1dB flatness in Electrical Characteristics from 85MHz (5V) and 115MHz (15V) to 65MHz (5V) and 55MHz (15V).Go
  • Deleted differential gain and phase from Electrical Characteristics Go
  • Deleted power supply operating range from from Electrical Characteristics.Go
  • Deleted Slew Rate vs Supply Voltage from Typical Characteristics Go
  • Deleted Differential Gain and Phase Loading from Typical Characteristics Go

Changes from Revision G (March 2008) to Revision H (September 2009)

  • Updated document format to current standardsGo
  • Updated information about THS3001EVM availabilityGo