SLOS217I July   1998  – December 2024 THS3001

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Feedback and Gain Resistor Values
      2. 7.1.2 Noise Calculations
      3. 7.1.3 Slew Rate
      4. 7.1.4 Offset Voltage
    2. 7.2 Typical Applications
      1. 7.2.1 General Configurations
      2. 7.2.2 Driving a Capacitive Load
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Design Considerations
        2. 7.4.1.2 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Evaluation Board
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) THS3001 UNIT
D (SOIC) DGN (HVSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 97.5 56.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 38.3 78.2 °C/W
RθJB Junction-to-board thermal resistance N/A 29.6 °C/W
ΨJT Junction-to-top characterization parameter N/A 4.7 °C/W
ΨJB Junction-to-board characterization parameter N/A 29.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 12.5 °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.