SBOS875C August   2017  – February 2023 THS3491

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Bare Die Information
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics: VS = ±15 V
    6. 8.6 Electrical Characteristics: VS = ±7.5 V
    7. 8.7 Typical Characteristics: ±15 V
    8. 8.8 Typical Characteristics: ±7.5 V
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-Down (PD) Pin
      2. 9.3.2 Power-Down Reference (REF) Pin
      3. 9.3.3 Internal Junction Temperature Sense (TJ_SENSE) Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Wideband Noninverting Operation
      2. 9.4.2 Wideband, Inverting Operation
      3. 9.4.3 Single-Supply Operation
      4. 9.4.4 Maximum Recommended Output Voltage
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Driving Capacitive Loads
      2. 10.1.2 Video Distribution
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 PowerPAD™ Integrated Circuit Package Design Considerations (DDA Package Only)
          1. 10.4.1.1.1 PowerPAD™ Integrated Circuit Package Layout Considerations
          2. 10.4.1.1.2 Power Dissipation and Thermal Considerations
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (July 2018) to Revision C (February 2023)

  • Added bare die package details to the data sheetGo
  • Removed bipolar-supply operating range and single-supply operating range specifications from Electrical Characteristics: VS = ±15 V Go
  • Added new test level A2 that is clarifies what is tested for die salesGo

Changes from Revision A (March 2018) to Revision B (July 2018)

  • Changed resistor values in Typical Arbitrary Waveform Generator Output Drive Circuit from 49.9 Ω to 40.2 ΩGo
  • Changed resistor values in Typical Arbitrary Waveform Generator Output Drive Circuit from 24.9 Ω to 30 ΩGo
  • Changed TA = 25°C to TA ≅ 25°C in Electrical Characteristics: ±15 V condition statementGo
  • Changed 100% tested at 25°C to 100% tested at ≅ 25°C in the footnote of Electrical Characteristics: ±15 V Go
  • Added DDA package only in Test Conditions column for "VOS" specificationGo
  • Added new VOS specifiction line for RGT packageGo
  • Added min/max values to RFB_TRACE specification Go
  • Changed units from: pF || kΩ to: kΩ || pF and changed typical spec accordinglyGo
  • Added min/max values to TJ_SENSE 25℃ value specificationGo
  • Changed TJ_SENSE temperature coefficient specification's typical value from 3 mV/℃ to 3.2 mV/℃ Go
  • Added min/max values to TJ_SENSE input impedance specificationGo
  • Changed "TA = 25°C" to "TA ≅ 25°C" in Electrical Characteristics: ±7.5 V condition statementGo
  • Changed "100% tested at 25°C" to "100% tested at ≅ 25°C" in the footnote of Electrical Characteristics: ±7.5 V Go
  • Added "DDA package only" in Test Conditions column for "VOS" specification Go
  • Added new VOS specifiction line for RGT packageGo
  • Changed units from "pF || kΩ" to "kΩ || pF" and changed typical values accordingly Go
  • Added min/max values to "TJ_SENSE 25℃ value" specificationGo
  • Added min/max values to "TJ_SENSE input impedance" specificationGo
  • Changed "TA = 25°C" to "TA ≅ 25°C" in Typical Characteristics: ±15 V condition statementGo
  • Changed ZOL low frequency value from 160 dB to 138 dB in Open-Loop Transimpedance Gain and Phase vs Frequency Go
  • Changed Overdrive Recovery Time grid lines and added gain informationGo
  • Added TJ_SENSE Voltage vs Ambient Temperature Go
  • Changed "TA = 25°C" to "TA ≅ 25°C" in Typical Characteristics: ±7.5 V condition statementGo
  • Changed Overdrive Recovery Time grid lines and added gain informationGo
  • Corrected polarity of negative supply capacitor in Wideband Noninverting Gain Configuration (5 V/V) Go
  • Corrected negative supply capacitor polarity in Wideband Inverting Gain Configuration (5 V/V) Go
  • Added "RISO" to "1 Ω" in Driving a Large Capacitive Load Using an Output Series Isolation Resistor Go
  • Added 1-kΩ resistor to Driving a Large Capacitive Load Using an Output Series Isolation Resistor Go
  • Changed supply values from ±15 V to ±7.5 V in Video Distribution Amplifier Application Go
  • Changed RS2 values from 100 Ω to 40.2 Ω in Load-Sharing Driver Application Go
  • Added 30-Ω resistor to Load-Sharing Driver Application Go
  • Added text to Design Requirements and Detailed Design Procedure sections Go
  • Added Application Curves section Go

Changes from Revision * (August 2017) to Revision A (March 2018)

  • Changed device status from Advance Information to Production Data Go