SLOS318L april   2000  – august 2023 THS4130 , THS4131

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Output Common-Mode Voltage
        1. 9.1.1.1 Resistor Matching
      2. 9.1.2 Driving a Capacitive Load
      3. 9.1.3 Data Converters
      4. 9.1.4 Single-Supply Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PowerPAD™ Integrated Circuit Package Design Considerations
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision K (August 2022) to Revision L (August 2023)

  • Changed MSOP and MSOP-PowerPad to VSSOP and HVSSOP in Thermal Information tableGo
  • Changed thermal specifications for DGN package in Thermal Information tableGo
  • Changed the Electrical Characteristics section to combine both Electrical Characteristics tables into one table with improved small-signal bandwidth, slew rate, settling time, total harmonic distortion (THD), spurious-free dynamic range (SFDR), voltage noise, offset voltage drift, output swing, and quiescent current parameters for the DGN package.Go
  • Changed input current noise typical from 1.3 pA/√Hz to 1.7 pA/√Hz for DGN package.Go
  • Changed common-mode input offset voltage maximum from 3.5 mV to 5.5 mV for DGN package.Go
  • Changed maximum input bias current from 6 µA to 15.4 µA for DGN packageGo
  • Changed single input resistance parameter into seperate common-mode and differential input resistance parameters for DGN packageGo
  • Changed Typical Characteristics: THS413xD, THS413xDGK title to Typical Characteristics and deleted obsolete Typical Characteristics: THS413xDGN section; all plots now in one sectionGo

Changes from Revision J (March 2022) to Revision K (August 2022)

  • Updated thermal specifications for DGK package in Thermal Information tableGo
  • Changed title of Electrical Characteristics: THS413xD to Electrical Characteristics: THS413xD, THS413xDGK Go
  • Changed title of Typical Characteristics: THS413xD to Typical Characteristics: THS413xD, THS413xDGK Go