SLOS930C November 2015 – October 2024 THS4541-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | THS4541-Q1 | THS4541W-Q1 | UNIT | |
---|---|---|---|---|
RGT (VQFN) | RGT (VQFN) | |||
16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 52 | 56.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 69 | 69 | °C/W |
RθJB | Junction-to-board thermal resistance | 25 | 30.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 2.7 | 3.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 25 | 30.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 9.3 | 14.2 | °C/W |