Similar to all high-speed devices, best system performance is achieved with close attention to board layout. General high-speed signal path layout suggestions include:
- Continuous ground planes are preferred for signal routing with matched impedance traces for longer runs; however, both ground and power planes must be opened up around the capacitive sensitive input and output device pins. When the signal goes to a resistor, parasitic capacitance becomes more of a band-limiting issue and less of a stability issue.
- Good high-frequency decoupling capacitors (0.01 µF) are required to a ground plane at the device power pins. Additional higher-value capacitors (2.2 µF) are also required but can be placed further from the device power pins and shared among devices. For best high-frequency decoupling, consider X2Y supply decoupling capacitors that offer a much higher self-resonance frequency over standard capacitors.
- Differential signal routing over any appreciable distance must use microstrip layout techniques with matched impedance traces.
- The THS4567 outputs
are sensitive to capacitive loading. Isolate the output of the THS4567 from any capacitive load by placing series
isolation resistors close to the amplifiers output pins.