SLLSEY3E May   2018  – May 2019 THVD1410 , THVD1450 , THVD1451 , THVD1452

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      THVD1410 and THVD1450 Simplified Schematic
      2.      THVD1451 Simplified Schematic
      3.      THVD1452 Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
    3.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings [IEC]
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Power Dissipation
    7. 7.7  Electrical Characteristics
    8. 7.8  Switching Characteristics
    9. 7.9  Typical Characteristics: All Devices
    10. 7.10 Typical Characteristics: THD1450, THVD1451 and THVD1452
    11. 7.11 Typical Characteristics: THVD1410
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Functional Modes for THVD1410 and THVD1450
      2. 9.4.2 Device Functional Modes for THVD1451
      3. 9.4.3 Device Functional Modes for THVD1452
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Data Rate and Bus Length
        2. 10.2.1.2 Stub Length
        3. 10.2.1.3 Bus Loading
        4. 10.2.1.4 Receiver Failsafe
        5. 10.2.1.5 Transient Protection
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Third-Party Products Disclaimer
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (March 2019) to E Revision

  • Changed THVD1451 From: Product Preview To: Production data Go

Changes from C Revision (February 2019) to D Revision

  • Changed THVD1410 From: Product Preview To: Production data Go

Changes from B Revision (December 2018) to C Revision

  • Changed THVD1452 From: Product Preview To: Production data Go

Changes from A Revision (May 2018) to B Revision

  • Added Feature: "Differential Output Exceeds 2.1 V..."Go
  • Changed Feature: ±18 kV IEC 61000-4-2 Air-Gap Discharge To: ±25 kV IEC 61000-4-2 Air-Gap DischargeGo
  • Added SOIC (8) package to THVD1451 Go
  • Added Thermal Pad to the THVD1450 DRB packageGo
  • Added Thermal Pad to the THVD1451 DRB packageGo
  • Changed all pins HBM ESD rating from 4 kV to 8 kVGo
  • Changed IEC ESD air-gap discharge rating from 18 kV to 25 kVGo
  • Changed THVD1410 power dissipation numbersGo
  • Changed THVD1410 driver tr, tf TYP from 400 ns to 460 ns and MAX from 600 ns to 680 nsGo
  • Changed THVD1410 receiver tr, tf TYP from 13 ns to 10 nsGo
  • Changed THVD1410 receiver tPHL, tPLH TYP from 60 ns to 35 nsGo
  • Added Typical Characteristics, THD1450DGo
  • Added condition to Figure 8 to Figure 3Go
  • Added Typical Characteristics, THD1410Go
  • Changed A to A/Y and B to B/Z in Figure 20 to Figure 24Go
  • Added 3rd paragraph to the Overview sectionGo

Changes from * Revision (November 2017) to A Revision

  • Changed the document status From: Advanced Information To: Production Mix data Go