SLLSEY3E May   2018  – May 2019 THVD1410 , THVD1450 , THVD1451 , THVD1452

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      THVD1410 and THVD1450 Simplified Schematic
      2.      THVD1451 Simplified Schematic
      3.      THVD1452 Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
    3.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings [IEC]
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Power Dissipation
    7. 7.7  Electrical Characteristics
    8. 7.8  Switching Characteristics
    9. 7.9  Typical Characteristics: All Devices
    10. 7.10 Typical Characteristics: THD1450, THVD1451 and THVD1452
    11. 7.11 Typical Characteristics: THVD1410
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Functional Modes for THVD1410 and THVD1450
      2. 9.4.2 Device Functional Modes for THVD1451
      3. 9.4.3 Device Functional Modes for THVD1452
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Data Rate and Bus Length
        2. 10.2.1.2 Stub Length
        3. 10.2.1.3 Bus Loading
        4. 10.2.1.4 Receiver Failsafe
        5. 10.2.1.5 Transient Protection
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Third-Party Products Disclaimer
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

THVD14xx is a family of noise-immune RS-485/RS- 422 transceivers designed to operate in rugged industrial environments. The bus pins of these devices are robust to high levels of IEC electrical fast transients (EFT) and IEC electrostatic discharge (ESD) events, eliminating the need for additional system level protection components.

Each of these devices operates from a single supply between 3 V and 5.5 V. The devices in this family feature an extended common-mode voltage range which makes them suitable for multi-point applications over long cable runs.

THVD14xx family of devices is available in small VSON and VSSOP packages for space constrained applications. These devices are characterized over ambient free-air temperatures from –40°C to 125°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
THVD1410 VSSOP (8) 3.00 mm × 3.00 mm
SOIC (8) 4.90 mm × 3.91 mm
THVD1450 VSON (8) 3.00 mm × 3.00 mm
VSSOP (8) 3.00 mm × 3.00 mm
SOIC (8) 4.90 mm × 3.91 mm
THVD1451 VSON (8) 3.00 mm × 3.00 mm
SOIC (8) 4.90 mm × 3.91 mm
THVD1452 VSSOP (10) 3.00 mm × 3.00 mm
SOIC (14) 8.65 mm × 3.91 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.