SLLSEY3E May   2018  – May 2019 THVD1410 , THVD1450 , THVD1451 , THVD1452

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      THVD1410 and THVD1450 Simplified Schematic
      2.      THVD1451 Simplified Schematic
      3.      THVD1452 Simplified Schematic
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
    3.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings [IEC]
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Power Dissipation
    7. 7.7  Electrical Characteristics
    8. 7.8  Switching Characteristics
    9. 7.9  Typical Characteristics: All Devices
    10. 7.10 Typical Characteristics: THD1450, THVD1451 and THVD1452
    11. 7.11 Typical Characteristics: THVD1410
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Functional Modes for THVD1410 and THVD1450
      2. 9.4.2 Device Functional Modes for THVD1451
      3. 9.4.3 Device Functional Modes for THVD1452
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Data Rate and Bus Length
        2. 10.2.1.2 Stub Length
        3. 10.2.1.3 Bus Loading
        4. 10.2.1.4 Receiver Failsafe
        5. 10.2.1.5 Transient Protection
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Third-Party Products Disclaimer
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics

over operating free-air temperature range (unless otherwise noted). All typical values are at 25°C and supply voltage of VCC = 5 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver: THVD1410
tr, tf Differential output rise/fall time  RL = 54 Ω, CL = 50 pF, See Figure 22 250 460 680 ns
tPHL, tPLH Propagation delay 250 500 ns
tSK(P) Pulse skew, |tPHL – tPLH| 10 ns
tPHZ, tPLZ Disable time 80 200 ns
tPZH, tPZL Enable time RE = 0 V, See Figure 23 and Figure 24 100 600 ns
RE = VCC, See Figure 23 and Figure 24 4 11 µs
Receiver: THVD1410
tr, tf Output rise/fall time  CL = 15 pF, See Figure 25 10 20 ns
tPHL, tPLH Propagation delay  35 110 ns
tSK(P) Pulse skew, |tPHL – tPLH| 7 ns
tPHZ, tPLZ Disable time 30 60 ns
tPZH(1), tPZL(1), tPZH(2), tPZL(2), Enable time DE = VCC, See Figure 26 60 140 ns
DE = 0 V, See Figure 27 6 14 µs
Driver: THVD1450, THVD1451, THVD1452
tr, tf Differential output rise/fall time RL = 54 Ω, CL = 50 pF, See Figure 22 1 3 6 ns
tPHL, tPLH Propagation delay 3 10 20 ns
tSK(P) Pulse skew, |tPHL – tPLH| 3.5 ns
tPHZ, tPLZ Disable time 15 25 ns
tPZH, tPZL Enable time RE = 0 V, See Figure 23 and Figure 24 20 50 ns
RE = VCC, See Figure 23 and Figure 24 2.5 10 µs
Receiver: THVD1450, THVD1451, THVD1452
tr, tf Output rise/fall time CL = 15 pF, See Figure 25 2 6 ns
tPHL, tPLH Propagation delay 25 40 ns
tSK(P) Pulse skew, |tPHL – tPLH| 3.5 ns
tPHZ, tPLZ Disable time 14 28 ns
tPZH(1), tPZL(1), tPZH(2), tPZL(2), Enable time DE = VCC, See Figure 26 50 110 ns
DE = 0V, See Figure 27 4 14 µs