SLLSFO2B December   2022  – March 2024 THVD2410V , THVD2412V , THVD2450V , THVD2452V

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics_250 kbps
    9. 5.9  Switching Characteristics_1 Mbps
    10. 5.10 Switching Characteristics_20 Mbps
    11. 5.11 Switching Characteristics_50 Mbps
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 ±70 V Fault Protection
      2. 7.3.2 Integrated IEC ESD and EFT Protection
      3. 7.3.3 Driver Overvoltage and Overcurrent Protection
      4. 7.3.4 Enhanced Receiver Noise Immunity
      5. 7.3.5 Receiver Fail-Safe Operation
      6. 7.3.6 Low-Power Shutdown Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Transient Protection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.10 Switching Characteristics_20 Mbps

20-Mbps (THVD2450V, THVD2452V with SLR = VIO) over recommended operating conditions. All typical values are at 25°C and supply voltage of VCC = 5 V, VIO = 3.3 V, unless otherwise noted. (1) 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
tr, tf Differential output rise/fall time RL = 54 Ω, CL = 50 pF
See Figure 6-3		 VCC = 3 to 3.6 V, Typical at 3.3 V 4 8 15 ns
VCC = 4.5 to 5.5 V, Typical at 5 V 4 7 15 ns
tPHL, tPLH Propagation delay VCC = 3 to 3.6 V, Typical at 3.3 V 6 12 30 ns
VCC = 4.5 to 5.5 V, Typical at 5 V 4 9 26 ns
tSK(P) Pulse skew, |tPHL – tPLH| VCC = 3 to 3.6 V, Typical at 3.3 V 1 3 ns
VCC = 4.5 to 5.5 V, Typical at 5 V 1 3 ns
tPHZ, tPLZ Disable time RE = X See Figure 6-4 and Figure 6-5 17 35 ns
tPZH, tPZL Enable time RE = 0 V 14 39 ns
RE = VIO 3 4.5 μs
tSHDN Time to shutdown RE = VIO 50 500 ns
Receiver
tr, tf Output rise/fall time CL = 15 pF See Figure 6-6 1.5 6 ns
tPHL, tPLH Propagation delay VIO = 3 V to 3.6 V 25 33 58 ns
VIO = 1.65 V to 1.95 V 25 35 60 ns
tSK(P) Pulse skew, |tPHL – tPLH| CL = 15 pF 0.5 5 ns
tPHZ, tPLZ Disable time DE = X 12 25 ns
tPZH(1),
tPZL(1)		 Enable time DE = VIO See Figure 6-7 50 82 ns
tPZH(2),
tPZL(2)		 Enable time DE = 0 V See Figure 6-8 2.8 5 μs
tD(OFS) Delay to enter fail-safe operation CL = 15 pF See Figure 6-9 7 10 18 μs
tD(FSO) Delay to exit fail-safe operation 19 32 50 ns
tSHDN Time to shutdown DE = 0 V See Figure 6-8 50 500 ns
(1) A, B are driver output and receiver input terminals for Half duplex devices; A/B are Receiver input, Y/Z are driver output terminals for Full duplex device