SLLSFO2B December   2022  – March 2024 THVD2410V , THVD2412V , THVD2450V , THVD2452V

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics_250 kbps
    9. 5.9  Switching Characteristics_1 Mbps
    10. 5.10 Switching Characteristics_20 Mbps
    11. 5.11 Switching Characteristics_50 Mbps
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 ±70 V Fault Protection
      2. 7.3.2 Integrated IEC ESD and EFT Protection
      3. 7.3.3 Driver Overvoltage and Overcurrent Protection
      4. 7.3.4 Enhanced Receiver Noise Immunity
      5. 7.3.5 Receiver Fail-Safe Operation
      6. 7.3.6 Low-Power Shutdown Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Transient Protection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Switching Characteristics_250 kbps

250-kbps (THVD2410V, THVD2412V with SLR = VIO) over recommended operating conditions. All typical values are at 25°C and supply voltage of VCC = 5 V , VIO = 3.3 V, unless otherwise noted. (1) 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
tr, tf Differential output rise/fall time RL = 54 Ω, CL = 50 pF
See Figure 6-3		 VCC = 3 to 3.6 V, Typical at 3.3V 450 560 1200 ns
VCC = 4.5 to 5.5 V, Typical at 5 V 500 625 1200 ns
tPHL, tPLH Propagation delay VCC = 3 to 3.6 V, Typical at 3.3V 500 720 ns
VCC = 4.5 to 5.5 V, Typical at 5 V 540 770 ns
tSK(P) Pulse skew, |tPHL – tPLH| VCC = 3 to 3.6 V, Typical at 3.3V 10 70 ns
VCC = 4.5 to 5.5 V, Typical at 5 V 10 70 ns
tPHZ, tPLZ Disable time RE = X See Figure 6-4 and Figure 6-5 40 75 ns
tPZH, tPZL Enable time RE = 0 V 70 280 ns
RE = VIO  2.5 4.5 µs
tSHDN Time to shutdown RE = VIO 50 500 ns
Receiver
tr, tf Output rise/fall time CL = 15 pF See Figure 6-6 7 20 ns
tPHL, tPLH Propagation delay 800 1270 ns
tSK(P) Pulse skew, |tPHL – tPLH| 5 45 ns
tPHZ, tPLZ Disable time DE = X 30 40 ns
tPZH(1) Enable time VIO = 3 V to 3.6 V; DE = VIO See Figure 6-7 90 120 ns
VIO = 1.65 V to 1.95 V, DE = VIO 100 130 ns
tPZL(1) VIO = 3 V to 3.6 V; DE = VIO 900 1320 ns
VIO = 1.65 V to 1.95 V; DE = VIO 900 1320 ns
tPZH(2),
tPZL(2)		 Enable time DE = 0 V See Figure 6-8 3.3 5.4 μs
tD(OFS) Delay to enter fail-safe operation CL = 15 pF See Figure 6-9 7 11 18 μs
tD(FSO) Delay to exit fail-safe operation 540 800 1260 ns
tSHDN Time to shutdown DE = 0 V See Figure 6-8 50 500 ns
(1) A, B are driver output and receiver input terminals for Half duplex devices; A/B are Receiver input, Y/Z are driver output terminals for Full duplex device