SLLSFS1B August   2023  – April 2024 THVD4431

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics_RS-485_500kbps
    9. 5.9  Switching Characteristics_RS-485_20Mbps
    10. 5.10 Switching Characteristics, Driver_RS232
    11. 5.11 Switching Characteristics, Receiver_RS232
    12. 5.12 Switching Characteristics_MODE switching
    13. 5.13 Switching Characteristics_RS-485_Termination resistor
    14. 5.14 Switching Characteristics_Loopback mode
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Integrated IEC ESD and EFT Protection
      2. 7.3.2 Protection Features
      3. 7.3.3 RS-485 Receiver Fail-Safe Operation
      4. 7.3.4 Low-Power Shutdown Mode
      5. 7.3.5 On-chip Switchable Termination Resistor
      6. 7.3.6 Operational Data Rate
      7. 7.3.7 Diagnostic Loopback
      8. 7.3.8 Integrated Charge pump for RS-232
    4. 7.4 Device Functional Modes
      1. 7.4.1 RS-485 Functionality
      2. 7.4.2 RS-232 Functionality
      3. 7.4.3 Mode Control
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length for RS-485
        2. 8.2.1.2 Stub Length for RS-485 Network
        3. 8.2.1.3 Bus Loading for RS-485 Network
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) 
MIN NOM MAX UNIT
VCC Supply voltage 3 5.5 V
VIO I/O supply voltage 1.65 VCC V
VI (RS-485) Input voltage at any bus terminal (R1, R2, R3, R4) in RS-485 mode(1) –7 12 V
VID Differential input voltage in RS-485 receive mode [ (R1-R2) or (R2-R1), (R3-R4) or (R4-R3) ] with on-chip termination resistor disabled  -12 12 V
VID Differential input voltage in RS-485 receive mode [ (R1-R2) or (R2-R1), (R3-R4) or (R4-R3) ] with on-chip termination resistor enabled - 5.5 5.5 V
VI (RS-232) Receiver input voltage in RS-232 mode -15 15 V
VIH High-level input voltage (L3, L4, L6, SLR, SHDN, TERM_TX, TERM_RX, MODE0, MODE1, MODE2, DIR inputs) 0.7*VIO VIO V
VIL Low-level input voltage (L3, L4, L6, SLR, SHDN, TERM_TX, TERM_RX, MODE0, MODE1, MODE2, DIR inputs) 0 0.3*VIO V
IO Output current, driver in RS-485 mode –60 60 mA
IOR Output current, receiver VIO = 1.8 V or 2.5 V –2 2 mA
IOR Output current, receiver VIO = 3.3 V or 5 V –4 4 mA
RL Differential load resistance in RS-485 mode 54 60 Ω
1/tUI Signaling rate in RS-485 mode SLR = VIO 500 kbps
SLR = GND or floating 20 Mbps
Signaling rate in RS-232 mode SLR = VIO 250 kbps
SLR = GND or floating 1 Mbps
1/tUI (loopback) Signaling rate in RS-485 loopback mode 0.5 Mbps
Signaling rate in RS-232 loopback mode 1 Mbps
TA (2) Operating ambient temperature -40 125 °C
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) Operation is specified for internal (junction) temperatures upto 150°C. Self-heating due to internal power dissipation should be considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which disables the driver and receiver when the junction temperature reaches 170°C.