SLLSFS1B August   2023  – April 2024 THVD4431

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics_RS-485_500kbps
    9. 5.9  Switching Characteristics_RS-485_20Mbps
    10. 5.10 Switching Characteristics, Driver_RS232
    11. 5.11 Switching Characteristics, Receiver_RS232
    12. 5.12 Switching Characteristics_MODE switching
    13. 5.13 Switching Characteristics_RS-485_Termination resistor
    14. 5.14 Switching Characteristics_Loopback mode
    15. 5.15 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Integrated IEC ESD and EFT Protection
      2. 7.3.2 Protection Features
      3. 7.3.3 RS-485 Receiver Fail-Safe Operation
      4. 7.3.4 Low-Power Shutdown Mode
      5. 7.3.5 On-chip Switchable Termination Resistor
      6. 7.3.6 Operational Data Rate
      7. 7.3.7 Diagnostic Loopback
      8. 7.3.8 Integrated Charge pump for RS-232
    4. 7.4 Device Functional Modes
      1. 7.4.1 RS-485 Functionality
      2. 7.4.2 RS-232 Functionality
      3. 7.4.3 Mode Control
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length for RS-485
        2. 8.2.1.2 Stub Length for RS-485 Network
        3. 8.2.1.3 Bus Loading for RS-485 Network
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Power Dissipation

PARAMETER TEST CONDITIONS Typical Max UNIT
PD (RS-485) Full Duplex mode with DIR = VIO, MODE2, MODE1, MODE0 = 011, R2/R1 are externally connected to R3/R4 in loopback fashion;
VIO = VCC = 5.5 V, TA = 125 °C,
L3 = square wave 50% duty		 Unterminated, TERM_TX = L, TERM_RX = L
 		 SLR = H 500 kbps 160 200 mW
SLR = L 20Mbps 390 450
TERM_TX = TERM_RX = VIO SLR = H 500 kbps 430 500 mW
SLR = L 20Mbps 500 575
PD (RS-232) RS-232 mode with MODE2, MODE1, MODE0 = 001  VCC = VIO = 5.5V, R3, R4, R6 bus lines loaded with 3 kΩ, R3 load cap = 1000 pF, L3 toggling SLR = L 1 Mbps 320 500 mW
VCC = VIO = 5.5V, R3, R4, R6 bus lines loaded with 3 kΩ, R3 load cap = 2500 pF, L3 toggling SLR = H 250 kbps 185 200 mW