SLLSFS1B August   2023  – April 2024 THVD4431

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics_RS-485_500kbps
    9. 5.9  Switching Characteristics_RS-485_20Mbps
    10. 5.10 Switching Characteristics, Driver_RS232
    11. 5.11 Switching Characteristics, Receiver_RS232
    12. 5.12 Switching Characteristics_MODE switching
    13. 5.13 Switching Characteristics_RS-485_Termination resistor
    14. 5.14 Switching Characteristics_Loopback mode
    15. 5.15 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Integrated IEC ESD and EFT Protection
      2. 7.3.2 Protection Features
      3. 7.3.3 RS-485 Receiver Fail-Safe Operation
      4. 7.3.4 Low-Power Shutdown Mode
      5. 7.3.5 On-chip Switchable Termination Resistor
      6. 7.3.6 Operational Data Rate
      7. 7.3.7 Diagnostic Loopback
      8. 7.3.8 Integrated Charge pump for RS-232
    4. 7.4 Device Functional Modes
      1. 7.4.1 RS-485 Functionality
      2. 7.4.2 RS-232 Functionality
      3. 7.4.3 Mode Control
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length for RS-485
        2. 8.2.1.2 Stub Length for RS-485 Network
        3. 8.2.1.3 Bus Loading for RS-485 Network
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics_MODE switching

Parameters over recommended operating conditions. All typical values are at 25°C and supply voltage of VCC = 5 V , VIO = 3.3 V, unless otherwise noted. 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tRDY Time from Shutdown to RS-232 ready MODE2, MODE1, MODE0 = 000 or floating; SHDN = GND to VIO; rest of logic input pins floating, VCC = 4.5 V to 5.5 V Time from 50% of rising SHDN to charge pump V- supply reaching -8 V; See Figure 6-11  0.05 0.1 ms
  MODE2, MODE1, MODE0 = 000 or floating; SHDN = GND to VIO; rest of logic input pins floating, VCC = 3 V to 3.6 V Time from 50% of rising SHDN to charge pump V- supply reaching -5 V; See Figure 6-11  0.1 0.4 ms
tR2_R4 Time to switch from RS-232 3T5R mode to RS-485 Full duplex mode L3 = Vio, MODE2 = GND, MODE1 from GND to Vio, MODE0 = Vio; SHDN = DIR = VIO; SLR, TERM_TX, TERM_RX= floating; Time from 50% of MODE1 rising edge to R2 reaching 2V; See Figure 6-12  0.04 0.1 µs
tR4_R2 Time to switch from RS-485 full dupplex mode to RS-232 3T5R mode L3 = Vio, MODE2 = GND, MODE1 from Vio to GND, MODE0 = Vio; SHDN = DIR = VIO; SLR, TERM_TX, TERM_RX= floating; Time from 50% of MODE1 falling edge to R2 reaching 300 mV; See Figure 6-12  2 2.1 µs
tLP_RS232 Time to switch from RS-232 loopback mode to normal RS-232 mode MODE2 = MODE1 = GND, MODE0 from GND to VIO; SHDN = VIO, L3 = GND; Time from 50% of MODE0 rising edge to L2 50% rising edge, -40 ℃ ≤ TA ≤ 85 ℃; See Figure 6-13  2 2.4 µs
tRS232_LP Time to switch from normal RS-232 mode to RS-232 loopback mode MODE2 = MODE1 = GND, MODE0 from VIO to GND; SHDN = VIO, L3 = GND; Time from 50% of MODE0 falling edge to L2 50% falling edge, -40 ℃ ≤ TA ≤ 85 ℃; See Figure 6-13  2 15 µs
tLP_RS485 Time to switch from RS-485 loopback mode to RS-485 full duplex mode MODE1 = MODE0 = VIO; MODE2 from VIO to GND; SHDN = VIO , SLR, TERM_TX, TERM_RX= floating; L3 = GND, Time from 50% of MODE2 falling edge to 50% of rising L2; See Figure 6-14  40 50 µs
tRS485_LP Time to switch from RS-485 full duplex mode to RS-485 loopback mode MODE1 = MODE0 = VIO; MODE2 from GND to VIO ; SHDN = VIO , SLR, TERM_TX, TERM_RX= floating; L3 = GND, Time from 50% of MODE2 rising edge to 50% of falling L2; See Figure 6-14  1 2 µs
tFHD_RS485 Time to switch from RS-485 full duplex to half duplex mode DIR= VIO, MODE2 = GND, MODE1 = VIO; MODE0 from VIO to GND ; SHDN = VIO , SLR, TERM_TX, TERM_RX= floating; L3= GND, 10k pull down resistor on L2, Time from 50% of MODE0 falling edge to 50% falling edge on L2; See Figure 6-15  0.5 1 µs
tHFD_RS485 Time to switch from RS-485 half duplex to full duplex mode DIR= VIO, MODE2 = GND, MODE1 = VIO; MODE0 from GND to VIO ; SHDN = VIO , SLR, TERM_TX, TERM_RX= floating; L3= GND, 10k pull down resistor on L2, Time from 50% of MODE0 rising edge to 50% rising edge on L2; See Figure 6-15  0.5 1 µs