Use of a 4-layer board is recommended for good heat conduction. Use layer 1 (top layer) for control signals, layer 2 as power ground layer for L-, layer 3 for the 24-V supply plane (L+), and layer 4 for the regulated output supply (VCC_IN/OUT).
Connect the thermal pad to L- with maximum amount of thermal vias for best thermal performance.
Use entire planes for L+, VCC_IN/OUT and L- to assure minimum inductance.
The L+ terminal must be decoupled to ground with a low-ESR ceramic decoupling capacitor. The recommended minimum capacitor value is 100 nF. The capacitor must have a voltage rating of 50 V minimum (100 V depending on max sensor supply fault rating) and an X5R or X7R dielectric.
The optimum placement of the capacitor is closest to the transceiver’s L+ and L- terminals to reduce supply drops during large supply current loads. See GUID-55E2ECAB-7333-4A59-AD3E-064409AAD3FF.html#SLLSEV59428 for a PCB layout example.
Connect all open-drain control outputs via 10 kΩ pull-up resistors to the VCC_IN/OUT plane to provide a defined voltage potential to the system controller inputs when the outputs are high-impedance.
Connect the RSET resistor between ILIM_ADJ and L-.
Decouple the regulated output voltage at VCC_IN/OUT to ground with a low-ESR, ≥ 1-μF, ceramic decoupling capacitor. The capacitor should have a voltage rating of 10 V minimum and an X5R or X7R dielectric.