SLLS228G December 1995 – August 2015 TIR1000
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
There is no fundamental information about how many layers should be used and how the board stackup should look. Again, the easiest way the get good results is to use the design from the EVMs of Texas Instruments. The magazine Elektronik Praxis
MODEL 1 | MODEL 2 | MODEL 3 | MODEL 4 | |
---|---|---|---|---|
Layer 1 | SIG | SIG | SIG | GND |
Layer 2 | SIG | GND | GND | SIG |
Layer 3 | VCC | VCC | SIG | VCC |
Layer 4 | GND | SIG | VCC | SIG |
Decoupling | Good | Good | Bad | Bad |
EMC | Bad | Bad | Bad | Bad |
Signal integrity | Bad | Bad | Good | Bad |
Self disturbance | Satisfaction | Satisfaction | Satisfaction | High |
Avoid right-angle bends in a trace and try to route them at least with two 45° corners. To minimize any impedance change, the best routing would be a round bend as shown in Figure 13.