4 Revision History
Changes from Revision U (December 2022) to Revision V (April 2023)
- Updated Overview, Functional Block Diagram, and
Feature Description sections Go
Changes from Revision T (December 2021) to Revision U (December 2022)
- Changed Absolute Maximum Ratings, ESD Ratings, Recommended Operating Conditions, and Thermal Information sections by merging TL07xH and TL07xx specificationsGo
- Changed Electrical Characteristics tables by merging TL07xC,
TL07xAC, TL07xBC, TL07xI, and TL07xM specificationsGo
- Changed gain bandwidth value of all non-NS/non-PS packages and non-TL07xM
devices from 3 MHz to 5.25 MHzGo
- Changed TL07xC, TL07xAC, TL07xBC, TL07xI, and TL07xM Switching
Characteristics tables by renaming to Electrical Characteristics (AC)
Go
- Changed input voltage noise density at 1 kHz for all non-PS/non-NS packages and all non-TL07xM devices to 37 nV/√Hz
Go
- Changed THD+N for all non-PS/non-NS packages and all non-TL07xM devices to 0.00012%Go
Changes from Revision S (July 2021) to Revision T (December 2021)
- Corrected DCK pinout diagram and table in Pin Configurations and
Functions sectionGo
Changes from Revision R (June 2021) to Revision S (July 2021)
- Deleted preview note from TL071H SOIC (8), SOT-23 (5) and SC70 (5)
packages throughout the data sheetGo
Changes from Revision Q (June 2021) to Revision R (June 2021)
- Deleted preview note from TL072H SOIC (8), SOT-23 (8) and TSSOP (8)
packages throughout the data sheetGo
- Added ESD information for TL072HGo
- Added IQ spec for TL072HGo
Changes from Revision P (November 2020) to Revision Q (June 2021)
- Deleted VSSOP (8) package from the Device Information
sectionGo
- Added DBV, DCK, and D Package,s to TL071H in Pin Configuration and
Functions sectionGo
- Deleted DGK Package, from TL072x in Pin Configuration and Functions
sectionGo
- Deleted tables with duplicate information from the Specifications
sectionGo
- Added D, DCK, and DBV package thermal information in Thermal Information for Single Channel: TL071H sectionGo
- Added D, DDF, and PW package thermal information in Thermal Information for Dual Channel: TL072H sectionGo
- Added IB and IOS specification for single channel DCK and DBV packageGo
- Added IQ spec for TL071HGo
- Deleted Related Links section from the Device and Documentation
Support sectionGo
Changes from Revision O (October 2020) to Revision P (November 2020)
- Added SOIC and TSSOP package thermal information in Thermal Information
for Quad Channel: TL074H section
Go
- Added Typical Characteristics:TL07xH section in Specifications
sectionGo
Changes from Revision N (July 2017) to Revision O (October 2020)
- Updated the numbering format for tables, figures, and
cross-references throughout the documentGo
- Features of TL07xH added to the Features
sectionGo
- Added link to applications in the Applications
sectionGo
- Added TL07xH in the Description sectionGo
- Added TL07xH device in the Device Information
sectionGo
- Added SOT-23 (14), VSSOP (8), SOT-23 (8), SC70 (5), and SOT-23 (5)
packages to the Device Information sectionGo
- Added TSSOP, VSSOP and DDF Package,s to TL072x in Pin
Configuration and Functions sectionGo
- Added DYY Package, to TL074x in Pin Configuration and Functions
sectionGo
- Removed Table of Graphs from the Typical Characteistics
sectionGo
- Deleted reference to obsolete documentation in Layout Guidelines
sectionGo
- Removed Related Documentation sectionGo
Changes from Revision M (February 2014) to Revision N (July 2017)
- Updated data sheet text to latest documentation and translation standardsGo
- Added TL072M and TL074M devices to data sheet Go
- Rewrote text in Description section Go
- Changed TL07x 8-pin PDIP package to 8-pin CDIP package in Device
Information table Go
- Deleted 20-pin LCCC package from Device Information table Go
- Added 2017 copyright statement to front page
schematicGo
- Deleted TL071x FK (LCCC) pinout drawing and pinout table in Pin Configurations and Functions section Go
- Updated pinout diagrams and pinout tables in Pin Configurations
and Functions section Go
- Added Figure 6-59 to Typical Characteristics sectionGo
- Added second Typical Application section application curves Go
- Changed document references in Layout Guidelines section Go
Changes from Revision L (February 2014) to Revision M (February 2014)
- Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout sectionGo