SLVS029H January   1984  – November  2015 TL499A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • P|8
  • PS|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VO Output voltage(2) –0.3 35 V
VI1 Input voltage, series regulator –0.3 35 V
VI2 Input voltage, switching regulator –0.3 10 V
Blocking-diode reverse voltage 35 V
Blocking-diode forward current 1 A
SW IN Power switch current 1 A
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds 260 °C
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±200 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±200-V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Output voltage, VO 2.9 30 V
Input voltage, VI1 (SERIES IN1) 4.5 32 V
Input voltage, VI2 (SW REG IN2) 1.1 10 V
Output-to-input differential voltage, switching regulator, VO – VI2 (see (1)) 1.2 28.9 V
Continuous output current, IO 100 mA
Power switch current (at SW IN) 500 mA
Current-limiting resistor, RCL 150 1000 Ω
Filter capacitor 100 470 µF
Pass capacitor 0.1 µF
Inductor, L (dcr ≤ 0.1 Ω) 50 150 µH
Operating free-air temperature, TA –20 85 °C
(1) When operating temperature range is TA≤ 70°C, minimum VO– VI2 is ≥ 1.2 V. When operating temperature range is TA ≤ 85°C, minimum VO – VI2 is ≥ 1.9 V.

6.4 Thermal Information

THERMAL METRIC(1) TL499A UNIT
P (PDIP) PS (SO)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance(2)(3) 49.7 110.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 38.8 69.0 °C/W
RθJB Junction-to-board thermal resistance 26.9 55.7 °C/W
ψJT Junction-to-top characterization parameter 16.1 20.1 °C/W
ψJB Junction-to-board characterization parameter 26.7 54.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Voltage deviation (see (1)) 20 30 mV/V
VO – VI2 Switching regulator minimum boost TA = –20°C to 70°C 1.2 V
TA = –20°C to 85°C 1.9
Dropout voltage Series regulator VI1 = 15 V, IO = 50 mA 1.8 V
Reference voltage (internal) VI1 = 5 V, VO = 3 V, IO = 1 mA 1.2 1.26 1.32 V
Reference-voltage change with temperature 5 10 mV/V
Output regulation (of reference voltage) IO = 1 mA to 50 mA 10 30 mV/V
Output current
(see Figure 3)		 Switching regulator VI2 = 1.1 V, VO = 12 V,
RCL = 150 Ω, TA = 25°C		 10 mA
VI2 = 1.5 V, VO = 15 V,
RCL = 150 Ω, TA = 25°C 		15
VI2 = 6 V, VO = 30 V,
RCL = 150 Ω, TA = 25°C		 65
Series regulator 100
Standby current Switching regulator VI2 = 3 V, VO = 9 V, TA = 25°C 15 80 µA
Series regulator VI1 = 15 V, VO = 9 V, RE2 = 4.7 kΩ 0.8 1.2 mA
(1) Voltage deviation is the output voltage difference that occurs in a change from series regulation to switching regulation: Voltage deviation = VO (series regulation) – VO (switching regulation)

6.6 Typical Characteristics

TL499A APPVSAT.png
Figure 1. Switch Saturation Voltage vs Temperature
TL499A APPVD.png
Figure 2. Diode Forward Voltage vs Temperature